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CP3002-RC/CP3002-RA
6.2.5
Catastrophic Cooling Failure Sensor
The Catastrophic Cooling Failure Sensor protects the processor from catastrophic overheating.
The Catastrophic Cooling Failure Sensor threshold is set well above the normal operating tem-
perature to ensure that there are no false trips. The processor will stop all executions when the
junction temperature exceeds approximately 125°C. Once activated, the event remains
latched until the CP3002-RC/CP3002-RA undergoes a power-on restart (all power off and then
on again).
This function cannot be enabled or disabled in the uEFI BIOS. It is always enabled to ensure
that the processor is protected in any event.
Note ...
When all Debug LED on the front panel are blinking, it indicates that the proces-
sor temperature is above 125°C.
6.3
Chipset Thermal Monitor Feature
The Intel® QM57 chipset includes one on-die thermal sensor to measure the chipset die tem-
perature.
The maximum Intel® QM57 chipset case temperature is 111°C
6.4
Thermal Characteristics for the CP3002-RC
The thermal concept of the CP3002-RC is based on a specially designed full-board heat
spreader and wedge lock clamping mechanisms.
The heat spreader provides optimal heat transfer to the board's top and bottom edges as well
as enhanced structural support for ruggedized environments.
The wedge locks serve two functions. First, they provide a highly stable mechanical fixation of
the board in the chassis slot. When expanded using the proper torque value, they form with the
heat spreader practically a single physical unit capable of withstanding very high shock and vi-
bration forces. Second, they are the primary mechanism for conduction of heat from the board
to the system chassis.
Cooling of the CP3002-RC is a function of the system chassis which must provide adequate
conduction cooling capability. To determine cooling performance, the board temperature can
be measured at the reference point indicated in the figure below.
ID 1039-3625, Rev. 1.0
Thermal Considerations
.
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