Chassis Installation; Heat Spreader - IEI Technology WAFER-ULT5 Manual

4.7 Chassis Installation

4.7.1 Heat Spreader

WARNING:
The heat spreader installed on the WAFER-ULT5 can only serve as a heat
conductor, which needs additional heat dissipation mechanism to achieve
suitable thermal condition. DO NOT put the WAFER-ULT5 with the heat
spreader directly on a surface that cannot dissipate system heat, and never run
the WAFER-ULT5 without the heat spreader secured to the board.
When the WAFER-ULT5 is shipped, it is secured to a heat spreader with five retention
screws. The heat spreader must have a direct contact with a heat dissipation surface to
ensure stable operation. In addition, a thin layer of thermal paste has to be applied onto
the heat dissipation surface where it contacts the heat spreader. The following diagrams
show an example of a heat sink module and how it can be installed for dissipating the heat
generated from the motherboard:
Page 52
Heat sink module:
Material: Aluminum
Size: 146 mm x 102 mm x 14.6 mm
WAFER-ULT5 SBC