Features - Xilinx Zynq UltraScale+ ZCU208 User Manual

Tile
DAC

Features

The XM655 balun add-on card uses the 8 x 50 x 2 female LPAM-50-01.0-L-08-2-K-TR
connectors and pinout as defined in
CoreHC2 connectors and cable assemblies are used. Digital I/O and I2C are supported on
headers.
The XM655 module features are:
• 8 ADC differential signals to 4 male Carlisle CoreHC2 connector pads
• 8 DACs differential signals to 4 male Carlisle CoreHC2 connector pads
• 2 ADC inputs – compression mount SMAs through low frequency baluns – Minicircuits
TCM2-33WX+
• 2 ADC inputs – compression mount SMAs through mid frequency baluns – Anaren
BD1631J50100AHF
UG1410 (v1.0) July 8, 2020
ZCU208 Board User Guide
Appendix C: HW-XM650/655 Balun Daughter Cards for Gen 3 RFSoC EVM
Figure 28: DAC 16 Lanes
Channel
0 1
2 3
0 1
2 3
0 1
2 3
0 1
2 3
XM650/655 Connector
JHC2
DAC228_T0_CH1
DAC228_T0_CH3
DAC229_T1_CH1
DAC229_T1_CH3
DAC230_T2_CH1
DAC230_T2_CH3
DAC231_T3_CH1
DAC231_T3_CH3
JHC4
Pinout. For signal break-out Carlisle
Send Feedback
JHC1
DAC228_T0_CH0
DAC228_T0_CH2
DAC229_T1_CH0
DAC229_T1_CH2
DAC230_T2_CH0
DAC230_T2_CH2
DAC231_T3_CH0
DAC231_T3_CH2
JHC3
X24155-062520
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