Recommended Soldering Conditions - NEC PD17062 Datasheet

26. RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the PD17062.
For details of the recommended soldering conditions, refer to our document SMD Surface Mount
Technology Manual (IEI-1207) .
Please consult with our sales offices in case any other soldering process is used, or in case soldering is
done under different conditions.
Table 26-1 Soldering Conditions for Surface-Mount Devices
PD17062GC- -3BE:
Soldering process
Infrared ray reflow
VPS
Partial heating method
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 ˚C and maximum relative humidity at 65% or less
Caution Do not apply more than a single process at once, except for "Partial heating method."
Table 26-2 Soldering Conditions for Through Hole Mount Devices
PD17062CU- : 48-pin plastic shrink DIP (600 mil)
Soldering process
Wave soldering Solder temperature: 260 C or less
(only for leads)
Flow time: 10 seconds or less
Partial heating method Terminal temperature: 260 C or less
Heat time: 10 seconds or less
Caution In wave soldering, apply solder only to the lead section. Care must be taken that jet solder does
not come in contact with the main body of the package.
64-pin plastic QFP (14 14 mm)
Soldering conditions
Peak package's surface temperature: 235 ˚C
Reflow time: 30 seconds or less (at 210 ˚C or more)
Maximum allowable number of reflow processes: 1
Note
Exposure limit : 7 days (20 hours of pre-baking is required at
125 ˚C afterward.)
Peak package's surface temperature: 215 ˚C
Reflow time: 40 seconds or less (at 200 ˚C or more)
Maximum allowable number of reflow processes: 2
Note
Exposure limit : 7 days (20 hours of pre-baking is required at
125 ˚C afterward.)
<Cautions>
(1) Do not start reflow-soldering the device if its temperature is
higher than the room temperature because of a previous
reflow soldering.
(2) Do not use water for flux cleaning before a second reflow
soldering.
Terminal temperature: 300 ˚C or less
Heat time: 3 seconds or less (for each side of device)
Soldering conditions
PD17062
Symbol
IR35-207-1
VP15-207-2
–
291