External Thermal Regulation Of The Cp3002-Ra - Kontron CP3002-RC User Manual

CP3002-RC/CP3002-RA Thermal Considerations
6.5

External Thermal Regulation of the CP3002-RA

To ensure the best possible basis for operational stability and long-term reliability, the CP3002-
RA is equipped with a heat sink. Coupled together with system chassis, which provides variable
configurations for forced airflow, controlled active thermal energy dissipation is guaranteed.
The physical size, shape, and construction of the heat sink and ensures the lowest possible
thermal resistance. In addition, the CP3002-RA has been specifically designed to efficiently
support forced airflow as found in modern CompactPCI systems.
Thermal Characteristic Graphs
The thermal characteristic graphs shown on the following sections illustrate the maximum am-
bient air temperature as a function of the volumetric airflow rate for the power consumption in-
dicated. The diagrams are intended to serve as guidance for reconciling board and system with
the required computing power considering the thermal aspect. One diagram per CPU version
and ruggedization level is provided. There are up to two curves representing upper level work-
ing points based on different levels of average CPU utilization. When operating below the cor-
responding curve, the CPU runs steadily without any intervention of thermal supervision. When
operated above the corresponding curve, various thermal protection mechanisms may take ef-
fect resulting in temporarily reduced CPU performance or finally in an emergency stop in order
to protect the CPU and the chipset from thermal destruction. In real applications this means
that the board can be operated temporarily at a higher ambient temperature or at a reduced
flow rate and still provide some margin for temporarily requested peak performance before
thermal protection will be activated.
An airflow of 2.0 m/s is a typical value for a standard Kontron ASM rack. For other racks or
housings the available airflow will differ. The maximum ambient operating temperature must be
recalculated and/or measured for such environments. For the calculation of the maximum
ambient operating temperature, the processor and chipset junction temperature must never
exceed the specified limit for the involved processor and chipset.
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