Thermal Management; Heatspreader Plate Assembly; Active/Passive Cooling Solutions; Operating With Kontron Heatspreader Plate (Hsp) Assembly - Kontron COMh-caRP User Manual

3.7 Thermal Management

3.7.1 Heatspreader Plate Assembly

A heatspreader plate assembly is available from Kontron for the COMh-caAP. The heatspreader plate
assembly is NOT a heat sink. The heatspreader plate transfers heat as quickly as possible from the
processor using a copper core positioned directly above the processor and a Thermal Interface
Material (TIM). The heatspreader plate is factory prpared with a TIM screen printed on the contacts
and may be fasten to the module without additional user actions.
The heatspreader plate works as a COM-HPC standard thermal interface and must be used with a heat
sink or external cooling devices to mainten the heatspreader plate at proper operating temperatures.
Unter worst-case conditions, the cooling mechanism must maintain an ambient air and heatspreader
plate temperature on any spot of the heatspreader's surface according the module's specification:
60°C for commercial temperature grade modules
75°C for extended temperature grade modules (E1)
85°C for industrial temperature grade modules (E2)

3.7.2 Active/Passive Cooling Solutions

Both active and passive thermal management approaches can be used with the heatspreader plate.
The optimum cooling solution depends on the aaplication and environmental conditions. Kontron's
active or passive cooling solutions are designed to cover the power and thermal dissipation for a
commercial temperature range used in housing with a suitable airflow.

3.7.3 Operating with Kontron Heatspreader Plate (HSP) Assembly

The operating temperature requirements are:
Maximum ambient temperature with ambient being the air surrounding the module
Maximum measurable temperature on any part on the heatspreader's surface
Temperature Grade Requirements
Commercial Grade at 60°C HSP temperature on MCP @100% load; needs to run at nominal frequency
Extended Grade(E1) at 75°C HSP temperature the MCP @ 75% load; is allowed to start throttling for thermal protection
Industrial Grade (E2) at 85°C HSP temperature the MCP @ 50% load; is allowed to start throttling for thermal protection
Table 31: Heatspreader Temperature Specification

3.7.4 Operating without Kontron Heatspreader Plate (HSP) Assembly

The operating temperature is the maximum measurable temperature on any spot of the module's
surface.
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