Chipset Thermal Monitor Feature; External Thermal Regulation - Kontron CP3002 User Manual

CP3002
This function cannot be enabled or disabled in the uEFI BIOS. It is always enabled to ensure
that the processor is protected in any event.
Note ...
When the TH LED on the front panel is blinking red at regular intervals, it indi-
cates that the processor temperature is above 125°C.
6.3

Chipset Thermal Monitor Feature

The Intel® QM57 chipset includes one on-die thermal sensor to measure the chipset die tem-
perature.
The maximum Intel® QM57 chipset case temperature is 111°C
6.4

External Thermal Regulation

To ensure the best possible basis for operational stability and long-term reliability, the CP3002
is equipped with a heat sink. Coupled together with system chassis, which provides variable
configurations for forced airflow, controlled active thermal energy dissipation is guaranteed.
The physical size, shape, and construction of the heat sink ensures the lowest possible thermal
resistance. In addition, the CP3002 has been specifically designed to efficiently support forced
airflow as found in modern CompactPCI systems.
Thermal Characteristic Graphs
The thermal characteristic graphs shown on the following sections illustrate the maximum am-
bient air temperature as a function of the volumetric airflow rate for the power consumption in-
dicated. The diagrams are intended to serve as guidance for reconciling board and system with
the required computing power considering the thermal aspect. One diagram per CPU version
level is provided. There are up to two curves representing upper level working points based on
different levels of average CPU utilization. When operating below the corresponding curve, the
CPU runs steadily without any intervention of thermal supervision. When operated above the
corresponding curve, various thermal protection mechanisms may take effect resulting in tem-
porarily reduced CPU performance or finally in an emergency stop in order to protect the CPU
and the chipset from thermal destruction. In real applications this means that the board can be
operated temporarily at a higher ambient temperature or at a reduced flow rate and still provide
some margin for temporarily requested peak performance before thermal protection will be ac-
tivated.
An airflow of 2.0 m/s is a typical value for a standard Kontron ASM rack. For other racks or
housings the available airflow will differ. The maximum ambient operating temperature must be
recalculated and/or measured for such environments. For the calculation of the maximum
ambient operating temperature, the processor and chipset junction temperature must never
exceed the specified limit for the involved processor and chipset.
ID 1042-9252, Rev. 2.0
Thermal Considerations
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