Table of Contents
Advertisement
Thermal Considerations
Thermal characteristic curves
• Thermal characteristic curve of the CP3002-RA with typical processor and graphics
controller workload
This load complies with the typical processor and graphics controller workload indicat-
ed in Chapter 5.2, "Power Consumption", Table 5-5.
• Thermal characteristic curve of the CP3002-RA with maximum processor and graph-
ics controller workload
This load complies with the maximum processor and graphics controller workload in-
dicated in Chapter 5.2, "Power Consumption", Table 5-6.
How to read the diagram
Choose a specific working point. For a given flow rate there is a maximum airflow input tem-
perature (= ambient temperature) provided. Below this operating point, thermal supervision will
not be activated. Above this operating point, thermal supervision will become active protecting
the CPU from thermal destruction. The minimum airflow rate provided must be more than the
value specified in the diagram.
Volumetric flow rate
The volumetric flow rate refers to an airflow through a fixed cross-sectional area (i.e. slot width
x depth. The volumetric flow rate is specified in m³/h (cubic-meter-per-hour) or cfm (cubic-feet-
per-minute) respectively.
Conversion: 1 cfm = 1.7 m³/h; 1 m³/h = 0.59 cfm
Airflow
At a given cross-sectional area and a required flow rate, an average, homogeneous airflow
speed can be calculated using the following formula:
Airflow = Volumetric flow rate / area.
The airflow is specified in m/s (meter-per-second) or in fps (feet-per-second) respectively.
Conversion: 1 fps = 0.3048 m/s; 1 m/s = 3.28 fps
The following figures illustrate the operational limits of the CP3002-RA taking into consideration
power consumption vs. ambient air temperature vs. airflow rate. The measurements were
made based on a 4HP slot and with both processor cores enabled.
Page 6 - 8
CP3002-RC/CP3002-RA
ID 1039-3625, Rev. 1.0
Advertisement
Table of Contents
