Audio Card And Connector; Sun Ultra 60 Service Manual ♦ March 1999, Revision A - Sun Microsystems Sun Ultra 60 Service Manual

Figure C–8 illustrates MII being used to interconnect both integrated circuits and
circuit assemblies. This enables separate signal transmission paths to exist between
the reconciliation sublayer, embedded in the PCIO ASIC, and a local PHY IC, and
between the reconciliation sublayer and a remote PHY IC. The unidirectional paths
between the reconciliation sublayer and the local PHY IC are composed of sections
A1, B1, C1 and D1. The unidirectional paths between the reconciliation sublayer and
the remote PHY IC are composed of sections A2, B2, C2, and D2.
Figure C–8
C.1.11

Audio Card and Connector

The audio card provides various audio applications from telephone-quality speech to
CD-quality music. The audio card supports four jacks of identical type: line in, line
out, headphone out, and microphone in. Table C–6 lists the major features of the
audio card and Figure C–9 illustrates a functional block diagram.
Sun Ultra 60 Service Manual ♦ March 1999, Revision A
C-24
MII Port Timing Model