Package Mechanical And Storage Specifications; Package Mechanical Specifications; Processor Package Assembly Sketch - Intel BX80605X3440 - Quad Core Xeon X3440 Reference

Package Mechanical and Storage Specifications

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Package Mechanical and
Storage Specifications
2.1

Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard via the LGA1156 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink.
components and how they are assembled together. Refer to
for complete details on the LGA1156 socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 2-1.

Processor Package Assembly Sketch

Substrate
System Board
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
2. For clarity the ILM is not shown.
Thermal/Mechanical Specifications and Design Guidelines
Figure 2-1 shows a sketch of the processor package
Figure 2-1
Core (die)
IHS
Chapter 3
include the following:
TIM
Capacitors
LGA1156 Socket
and Chapter 4
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