Product Specifications; Wr-Zen Tp - Safran WR-ZEN Series User Manual

2.4 Product Specifications
2.4

Product Specifications

2.4.1

WR-ZEN TP

System On-Chip
Physical Dimension
Environmental Conditions
Front Panel
18
SoC: Xilinx Zynq series
CPU: Dual ARM® CortexTM-A9 MP@ 866 MHz
Memory:
512 MB DDR3 (32-bit bus)
256 Mbits Quad-SPI Flash
16GB SD Card
Dimension: 431 mm x 44 mm x 300 mm / (1 Rack Unit)
Color: White (Metallic)
Temperature: -10ºC ~ +50ºC
Humidity: 0% ~ 90% RH
Ethernet: 2x 100/1000 Base-T RJ45 (Management, NTP)
FMC: 1x Low-Pin count FMC slot (LPC)
Using HPC- FMC footprint to support extra GTP channel/clock on
board
SFP Ports: 2x 1GbE
Clocks I/O: 5x SMA connectors (3.3V @50Ω):
10MHz SIN OUT ref.clock (PLL)
CLK TTL OUT
PPS OUT (LVTTL)
PPS IN (LVTTL)
10MHz IN (TTL/CMOS/ECL/clipped sine)
Timing: Common outputs to provide Timing
2xRJ45, ToD (NMEA) RS485
2xDB9, 4x configurable* xPPS/CLK
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2 WR-ZEN Series User Manual Rev. v5.1