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2.2
Specification
Processor
Chipset
Memory
Memory Type
Memory Slot Qty.
Total Memory Capacity
Port and Connector
USB
VGA
Mgmt
Expansion Slot
OCP Slot
Storage Drive
Power
Physical
Dimension
Product Weight
Environmental
Operating Temperature
Storage & Transportation
Temperature
Operating Humidity
Storage & Transportation
Humidity
Product Specification
Intel® Xeon Scalable processor, TDP up to 165W
Intel® C622
DDR4 RDIMM/LRDIMM
16
Supports up to 512GB (32GB per memory module)
Two USB 3.0 ports (front side)
One VGA port (front side)
One RJ45 IPMI port (front side)
Option 1: Two PCIe Gen3 x16 FHFL
Option 2: One PCIe Gen3 x16 HHHL + Two PCIe Gen3 x8
HHHL
One OCP card, OCP2.0 x16 slot on the motherboard
One
SATA/PCIe x4 M.2
Centralized OCP Power Shelf, compliant with Open Rack
v2
830mm (L) × 537mm (W) × 95.2mm (H)
Full
configuration: 7kg
Cubby weight: 15kg (one
compute sleds)
5°C - 35°C (41°F - 95°F)
-40°C - 60°C
20% - 80% relative humidity
20% - 93% (40°C) relative humidity
card on the motherboard
cubby is available for 3
6
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