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2 PinS anD PaCKaGeS
Diagram of pad layout
75
80
85
90
91
1
Chip thickness:
400 µm
Pad opening (X × Y): 77 × 85 µm (No. 1 to No. 25, No. 51 to No. 72)
85 × 77 µm (No. 26 to No. 50, No. 73 to No. 91)
Note: A chip thickness that exceeds 400 µm cannot be specified even if a chip other than the standard
thickness type is required.
2-2
70
65
60
Die No.
Y
5
10
2.655 mm
Figure 2.
1.1.2 S1C63016 pad layout diagram
Seiko epson Corporation
55
X
(0, 0)
15
20
S1C63003/004/008/016 TeChniCal Manual
50
45
40
35
30
25
(Rev. 1.1)
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