Intel 815EG Design Manual page 196

Chipset platform for use with universal socket 370
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Third-Party Vendor Information
GPA (a.k.a. AIMM) Card (Vendors Contact Phone)
• Kingston
• Smart Modular
• Micron Semiconductor
TMDS Transmitters
Silicon Images
Texas Instrument
Chrontel
TV Encoders
Chrontel
Conexant
Focus Bill Schillhammer [billhammer@focusinfo.com]
(978) 661-0146
Philips
Texas Instrument
Combo TMDS Transmitters/TV Encoders
Chrontel
Texas Instrument
LVDS Transmitter
National Semiconductor
196
JK_TSAI@kingston.com
Richard_Kanadjian@kingston.com
James.Lee@smartm.com
Arthur.SAINIO@smartm.com
TBD
John Nelson (408) 873-3111
Greg Davis [gdavis@ti.com] (214) 480-3662
Chi Tai Hong [cthong@chrontel.com] (408) 544-2150
Chi Tai Hong [cthong@chrontel.com] (408)544-2150
Eileen Carlson [eileen.carlson@conexant.com] (858) 713-3203
Marcus Rosin [marcus.rosin@philips.com]
Greg Davis[gdavis@ti.com] (214) 480-3662
Chi Tai Hong [cthong@chrontel.com] (408) 544-2150
Greg Davis[gdavis@ti.com] (214) 480-3662
387R Jason Lu [Jason.Lu@nsc.com] (408) 721-7540
®
Intel
815EG Chipset Platform Design Guide
R

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