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Intel Manuals
Motherboard
815EG
Design manual
Figure 7. Bottom Signal Layer Before The Ground Fill Near The I/O Area; Figure 8. Bottom Signal Layer After The Ground Fill Near The I/O - Intel 815EG Design Manual
Chipset platform for use with universal socket 370
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General Design Considerations
Figure 7. Bottom Signal Layer before the Ground Fill Near the I/O Area
Figure 8. Bottom Signal Layer after the Ground Fill Near the I/O
30
®
Intel
815EG Chipset Platform Design Guide
R
Ground Fill
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