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82563EB
Intel 82563EB Manuals
Manuals and User Guides for Intel 82563EB. We have
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Intel 82563EB manual available for free PDF download: Design Manual
Intel 82563EB Design Manual (72 pages)
Brand:
Intel
| Category:
Motherboard
| Size: 0.66 MB
Table of Contents
Table of Contents
5
Introduction
9
Scope
9
Reference Documents
10
Product Codes
10
Product Ordering Codes
10
Kumeran Connection to 82563EB/82564EB Gigabit Platform LAN Connect
11
82563EB/82564EB Connection to the 631Xesb/632Xesb
11
Kumeran Reference Clock
12
631Xesb/632Xesb Clock Source Diagrams
12
Reference Clocks Required
12
631Xesb/632Xesb to 82563EB/82564EB Signals
13
AC Capacitor Placement
13
Ethernet Component Design Guidelines
15
General Design Considerations for Ethernet Platform LAN Connect Devices
15
Clock Source
15
Integrated Magnetics Module for 1000 BASE-T
15
Third-Party Magnetics Modules
16
Designing with the 82563EB/82564EB Gigabit Ethernet Platform LAN Connect
17
Powering down the 82563EB/82564EB Gigabit Ethernet Platform LAN Connect
17
Serial EEPROM for 82563EB/82564EB Gigabit Ethernet Platform LAN Connect Implementations
17
Power Supplies for the 82563EB/82564EB Device
17
LVR Circuit for the 82563EB (Dual Port)
18
LVR Circuit for the 82564EB (Single Port)
18
PNP Transistors Vendors/Part Numbers
18
82563EB Power Sequencing
19
Maximum Difference between Voltage Rails
19
82563EB/82564EB Device Power Supply Filtering
20
82563EB/82564EB Device Test Capability
20
Minimum Number of Bypass Capacitors Per Voltage Rail
20
XOR Testing
21
XOR Tree Concept
21
Tested Pins Included in XOR Tree (33 Pins)
22
Frequency Control Device Design Considerations
23
Frequency Control Component Types
23
Quartz Crystal
23
Fixed Crystal Oscillator
23
Programmable Crystal Oscillators
24
Ceramic Resonator
24
Crystal Selection Parameters
25
Vibrational Mode
25
Crystal Manufacturers and Part Numbers
25
Crystal Parameters
25
Nominal Frequency
26
Frequency Tolerance
26
Temperature Stability and Environmental Requirements
26
Calibration Mode
26
Load Capacitance
27
Internal Oscillator Circuit
27
Shunt Capacitance
28
Equivalent Series Resistance
28
Drive Level
28
Aging
28
Reference Crystal
28
Reference Crystal Selection
29
Circuit Board
29
Temperature Changes
29
Oscillator Support
31
82563EB/82564EB Clock Oscillator Specifications
31
Oscillator Manufacturers and Part Numbers
31
Oscillator Solution
32
High Voltage Solution (VDD = 3.3V)
32
Ethernet Component Layout Guidelines
33
Layout Considerations for the 82563EB/82564EB Ethernet Platform LAN Connect Devices
33
Guidelines for Component Placement
33
Crystals and Oscillators
34
General Placement Distances for 1000 BASE-T Designs
34
Board Stack up Recommendations
35
Differential Pair Trace Routing for 10/100/1000 Designs
35
Signal Termination and Coupling
35
Signal Trace Geometry for 1000 BASE-T Designs
35
Trace Length and Symmetry for 1000 BASE-T Designs
36
Trace Routing, Geometry and Length for the Kumeran Interface
36
Signal Termination and Coupling
37
Trace Routing
37
Impedance Discontinuities
38
Reducing Circuit Inductance
38
Signal Isolation
38
Power and Ground Planes
38
Traces for Decoupling Capacitors
39
Ground Planes under a Magnetics Module (Copper-Based Gigabit Designs)
40
Ground Plane Separation
40
Ideal Ground Split Implementation
41
Capacitor Stuffing Option Recommended Values
41
Light Emitting Diodes for Designs Based on 82563EB/82564EB Device
42
Thermal Design Considerations
42
Physical Layer Conformance Testing
42
Conformance Tests for 10/100/1000 Mbps Designs
43
Troubleshooting Common Physical Layout Issues
43
82563EB/82564EB Exposed Pad
45
Introduction
45
Component Pad, Solder Mask and Solder Paste
46
82563EB/82564EB Silkscreen and Components Pad (Top View)
46
82563EB/82564EB Solder Mask
47
82563EB/82564EB Solder Paste
47
Landing Pattern a (no Via in Pad)
48
82563EB/82564EB Landing Pattern a (Top View - Vias on the Outside of the Exposed Pad*)
48
Landing Pattern B (Thermal Relief; no Via in Pad)
49
Landing Pattern B (Top View - Vias on the Outside of the Exposed Pad*)
49
Landing Pattern C (Via in Pad)
50
82563EB/82564EB Landing Pattern C (Top View - Vias on the Inside of the Exposed Pad*)
50
Bill of Materials (BOM)
51
BOM for the 631Xesb/632Xesb and the 82563EB/82564EB Gigabit Platform LAN Connect
51
Design, Layout, and Test Checklists
53
Schematic Checklist
53
Board Layout and Placement Checklist
58
Validation Checklist
62
Reference Schematic
63
System Manageability
65
Measuring LAN Reference Frequency Using a Frequency Counter
67
Background
67
Required Test Equipment
67
Indirect Probing Method
67
Indirect Frequency Measurement and Frequency Accuracy Calculation Steps
68
Indirect Probing Setup
68
Direct Probing Test Method, Applicable for most 10/100 Devices (Devices that Do NOT Support 1000Base-T)
69
Direct Frequency Measurement and Frequency Accuracy Calculation Steps
70
Direct Probing Method
70
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