Huawei RH2288 V3 User Manual page 65

RH2288 V3 Server
User Guide
Table 2-12 RAS features
Mod
ule
CPU
DIM
M
PCIe
QPI
OS
Issue 32 (2019-03-28)
Feature
Corrected machine
check interrupt (CMCI)
Failed DIMM isolation
Memory thermal
throttling
Rank sparing
Memory address parity
protection
Memory demand and
patrol scrubbing
Memory mirroring
Single device data
correction (SDDC)
Device tagging
Data scrambling
PCIe advanced error
reporting
Intel QPI link level retry
Intel QPI protocol
protection via CRC
Core disable for fault
resilient boot (FRB)
Corrupt data
containment mode
Socket disable for FRB
Copyright © Huawei Technologies Co., Ltd.
Description
Corrects error-triggered interrupts.
Identifies a faulty dual in-line memory module
(DIMM), and isolates it from others before replacing
the DIMM.
Automatically adjusts DIMM temperatures to avoid
damage due to overheating.
Allocates memory ranks as backup ranks to prevent the
system from crashing due to uncorrectable errors.
Detects memory command and address errors.
Provides the memory patrol function for promptly
correcting correctable errors upon detection. If these
errors are not corrected promptly, uncorrectable errors
may occur.
Improves system reliability.
Provides a single-device, multi-bit error correction
capability to improve memory reliability.
Degrades and rectifies DIMM device faults to improve
DIMM availability.
Optimizes data stream distribution and reduces the
error possibility to improve the reliability of data
streams in the memory and the capability to detect
address errors.
Improves server serviceability.
Provides a retry mechanism upon encountering errors
to improve QPI reliability.
Provides cyclic redundancy check (CRC) protection
for QPI packets to improve system reliability.
Isolates a faulty CPU during startup to improve system
reliability and availability.
Identifies the memory storage unit that contains
corrupted data to minimize the impact on running
programs and improve system reliability.
Isolates a faulty socket during startup to improve
system reliability.
2 Overview
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