Epson S1C17M20 Technical Manual page 275

23 PACKAGE
SQFN5-32 package (S1C17M20/M23)
Top View
Bottom View
0.35 /0.45
min
* The potential of the EXPOSED DIE PAD is the same as that of the substrate potential (V
23-2
4.9 /5.1
min
INDEX
3.0 /3.2
min
9
8
C0.3
1
32
max
Figure 23.2 SQFN5-32 Package Dimensions
Seiko Epson Corporation
max
max
16
17
24
EXPOSED DIE PAD
25
0.5
S1C17M20/M21/M22/M23/M24/M25
(Unit: mm)
) on the back of the IC.
SS
TECHNICAL MANUAL (Rev. 1.0)