Page 1 7015 Models R30, R40, and R50 CPU Enclosure Installation and Service Guide...
Page 2 Third Edition (April 1997) This edition notice applies to the 7015 Model R30, R40, and R50 CPU Enclosure Installation and Service Guide . The following paragraph does not apply to the United Kingdom or any country where such provisions are inconsistent with local law: THIS PUBLICATION IS PRINTED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Page 3: Table Of Contents
Table of Contents Communications Statements ..........Safety Notices .
Page 4 Maintenance Menu ........... . 2-21 Display Configuration .
Page 5 Adapter Cable ............4-73 Adapter .
Page 6 Appendix D. Off Line Diagnostic Error Codes ......Error Logging ............D-26 Appendix E.
Page 7: Communications Statements
Communications Statements The following statement applies to this product. The statement for other products intended for use with this product appears in their accompanying manuals. Federal Communications Commission (FCC) Statement Note: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
Page 8 for Class A equipment were derived for commercial and industrial environments to provide reasonable protection against interference with licensed communication equipment. Attention: This is a Class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures. International Electrotechnical Commission (IEC) Statement This product has been designed and built to comply with IEC Standard 950.
Page 9 Dieses Gerät ist berechtigt in Übereinstimmung mit dem deutschen EMVG vom 9.Nov.92 das EG-Konformitätszeichen zu führen. Der Aussteller der Konformitätserklärung ist die IBM Germany. Dieses Gerät erfüllt die Bedingungen der EN 55022 Klasse A. Für diese Klasse von Geräten gilt folgende Bestimmung nach dem EMVG: Geräte dürfen an Orten, für die sie nicht ausreichend entstört sind, nur mit besonderer...
Page 10 Service Guide...
Page 11: Safety Notices
Safety Notices Note: For a translation of danger and caution notices, see the System Unit Safety Information manual, form number SA23-2652. Definitions of Safety Notices A danger notice indicates the presence of a hazard that has the potential of causing death or serious personal injury.
Page 12 Laser Safety Information The optical drive in this system unit is a laser product. The optical drive has a label that identifies its classification. The label, located on the drive, is shown below. CLASS 1 LASER PRODUCT LASER KLASSE 1 LUOKAN 1 LASERLAITE APPAREIL A LASER DE CLASSE 1 TO IEC 825:1984 CENELEC EN 60 825:1991...
Page 13: About This Book
About This Book This book provides maintenance information that is specific to the 7015 Models R30, R40, and R50 CPU Enclosures. It also contains maintenance analysis procedures (MAPs) that are not common to other systems. MAPs that are common to all systems are contained in the Diagnostic Information For Micro Channel Bus Systems.
Page 14 Service Guide...
Page 15: Chapter 1. Reference Information
Chapter 1. Reference Information This chapter contains information about part locations; connector locations; slot locations on the system planar, I/O planars; data and power flow; and CPU enclosure specifications. Description 7015 CPU Enclosures equipped with a typical configuration contain the following: System planar containing memory cards, CPU cards, and an I/O card Two I/O planars containing 16 Micro Channel adapter slots System interface board containing a parallel port, three serial ports, and two RS485 ports,...
Page 16: Cpu Enclosure Locations
CPU Enclosure Locations Front View with Bezel Bezel Door Front View without Bezel CD-ROM Drive Operator 3.5-Inch Front Access Optional Panel Diskette Plate Media Drive Position Service Guide...
Page 17: Front View Without Front Access Plate
Front View without Front Access Plate Optional CD-ROM Drive Operator 3.5-Inch Disk Drive Media Panel Diskette (R50 can Position Drive have two) Media Module Module Lateral CPU Card Slots (4) Memory Card Slots (4) Planar 1 Card I/O Card Slot Note: The R50 CPU enclosure frame includes card guides not shown in the figure above.
Page 18: Rear Connector Locations With Rear Access Plate Removed
Rear Connector Locations with Rear Access Plate Removed Power Power Supply Power Cooling Unit or Cooling Unit or 2nd Fans Light Light 2nd Power Supply Power Supply Fans Power Supply Fan 4 Fan 3 Fan 2 Fan 1 Battery Backup Unit Connector RS485 (In) RS485 (Out)
Page 19: Cpu Module (Top View With Top Cover Removed)
CPU Module (Top View with Top Cover Removed) R30 and R40 CPU Module Fans Fan 08 Lateral Planar 1 Card Fan 09 Fan 10 I/O Card Docking Screw CPU Card Slots (4) Memory Card Slots (4) System Planar CPU Module Fans Fan 08 Lateral Planar 1 Card...
Page 20: I/O Module (Top View With Rear Access Plate Removed)
I/O Module (Top View with Rear Access Plate Removed) Power Supply Power Light Power Supply Cooling Unit or 2nd Power Supply Power Supply Power Light Battery Backup Unit Connector Cooling Unit or 2nd Power RS485 Supply Fans Connectors (In) Power RS485 Supply Connectors...
Page 21: Media Module
Media Module Fan 6 Media Module Fans (3) Fan 5 Fan 7 Optional Disk Drive (R50) Disk Drive CD-ROM Drive Optional Media Position Operator Panel 3.5-Inch Diskette Drive Note: The Model R50 CPU Enclosure has a bay for an optional disk drive located above the standard disk drive bay.
Page 22: System Planar Connector Locations (Top View)
System Planar Connector Locations (Top View) R30 and R40 Lateral Planar 1 Interface Connectors I/O Card CPU Card Memory Slot Slots Card Slots Lateral Planar 1 Interface Connectors I/O Card CPU Card Memory Slot Slots Card Slots Service Guide...
Page 23 Memory Cards There are four types of memory card available for use with the R30, R40 or R50 systems. They are the MRX card, the RLX card, the NFX card, and the SF5 card. The base MRX memory card looks like the following figure. Base MRX Memory Card Bank 1 Bank 1...
Page 24 The next three types of memory cards are shown below. A two bank (8 slots) RLX card, a four bank (16 slots) NFX card, and a four bank (16 slots) SF5 card. Each bank can house four memory module kits composed of four memory memory modules each, which comply with the JEDEC standard for 168 pin, ECC, 60 ns, 5 volt memory modules.
Page 25: I/O Planars (Top View)
According to both the size and the number of memory module kits installed on the RLX, NFX, or SF5 cards, these can be divided into the following models: NF64 board, based on 4M bit technology, which gives 64MB memory. It houses two MM32 memory module kits.
Page 26: 7015 Model R00 Rack With Power Distribution Bus (Pdb)
7015 Model R00 Rack with Power Distribution Bus (PDB) Power Supply Power Cords Rear of CPU Enclosure Power Distribution Bus Outlet Power Cords Outlets (6) Power Distribution Bus 1-12 Service Guide...
Page 27: Data Flow
Data Flow Operator Panel System EEPROMs Micro Processor S1 BUMP Console VPD EPROMs Battery S2 Service Console Reset/Scroll Button Parallel Interface Keylock Diskette Drive Power Supply System Planar I2C bus CPU Array TOD Clock NVRAM CPU card Flash EPROM Backup EPROM COP bus Standard BUMP...
Page 28 Primary Micro Channel Planar MCA Cards Misc Secondary Micro Channel Planar MCA Cards Misc 1-14 Service Guide...
Page 29: Power Flow
Power Flow Power Supply System AC Cable Power Distribution Standby Power Voltages Voltages –12 –12 +3,3/3,6 CPU Module Fans EEPROM Media Module Fans Power Supply Fans/ Cooling Unit Fans 3,5 Inch Diskette Drive Operator Panel I/O Module System Interface System Interface Board Board CPU Card...
Page 30: Typical Rail Installation
Typical Rail Installation Rear of Rail Front of Rail Front of Rack Mounting Hardware For CPU Enclosure Detail A – Front of Rail Detail B – Rear of Rail Rail Mounting Screw Rail Lock Washer Guide Pins Rail 1-16 Service Guide...
Page 31: Specifications
Specifications Dimensions Height: 266.7 mm (10.5 inches) Depth: 1041 mm (41 inches) Width: 445 mm (17.5 inches) AC Frequency 50 to 60 Hz Heat Output 718 W (2450 BTU per hour) typical Operating Environment Class C: 10 to 40 C (50 to 104 F) Wet bulb temperature: 27 C (80.6 F) Operating Voltage 200 to 240 V ac (for AC system unit)
Page 32: External Ac Power Cables
External AC Power Cables To avoid electrical shock, the manufacturer provides a power cable with a grounded attachment plug. Use only properly grounded outlets. Power cables used in the United States and Canada are listed by Underwriter’s Laboratories (UL) and certified by the Canadian Standards Association (CSA). These power cords consist of the following: Electrical cables, type ST Attachment plugs complying with National Electrical Manufacturers Association (NEMA)
Page 33: Service Inspection Guide
Service Inspection Guide Perform a service inspection on the system when: The system is inspected for a maintenance agreement. Service is requested and service was not recently performed. An alterations-and-attachments review is performed. Changes are made to the equipment that might affect the safe operation of the equipment.
Page 34 1-20 Service Guide...
Page 35: Chapter 2 Using Systemguard
Chapter 2 Using SystemGuard This chapter introduces the SystemGuard service processor which is included in all Symmetric Multiprocessor models. Introduction SMP servers include a service processor, called SystemGuard, as a standard feature. SystemGuard continually monitors the hardware as well as the operating system. If, for instance, a CPU fails, the system detects this, reboots itself automatically and runs the built-in diagnostics on the hardware.
Page 36: Systemguard Power
SystemGuard Power SystemGuard has its own DC power boundary. This means that even if the system power is off (power button of the system in the off position), SystemGuard is still powered on, as long as the CPU enclosure still has power. This allows control of the system even though the system is down.
Page 37: The Operator Panel
The Operator Panel The Operator Panel is the first level of user interface to SystemGuard. The Operator Panel has the following features: Power button It should generally stay pushed in all the time if you want to be able to power on or off the system remotely.
Page 38: Systemguard Consoles
SystemGuard Consoles SystemGuard works with two types of consoles: The Bump Console , which is an ASCII terminal attached to the S1 serial port. This console provides the normal input to the BUMP. It can be local or remote. The line speed for the BUMP console must be set to 9600 baud for either type of connection.
Page 39: Init Phase
Init Phase Init phase is entered when the power button on the Operator Panel is pressed on or when the power command is entered on the BUMP Console or Service Console. If the System Key is in Normal mode, the BUMP runs the built-in or resident power-on (PON)-tests on the CPU module hardware, IPLs on the first available processor, runs the functional power on self-tests (POST) on the I/O subsystem to check the system, and finally loads the AIX operating system.
Page 40 Phase Change (Stand-By to Init) The phase change from Stand-By to Init is called Crossing The Power boundary. This is achieved by pushing the power button on the Operator Panel or by typing the keyword power at the Stand-By prompt (>). Note that if you type power while the power button is not pushed in, nothing happens until you press the power button.
Page 41 Power-on (PON) Tests PON tests are run by SystemGuard whenever the system power comes on. There are two types of tests: A comprehensive set of tests are performed on the processors, cache, memory and related hardware when the Fast-IPL flag is disabled. A minimum core set of tests are performed on the processors, cache, memory and related hardware during fast-IPL which cannot be turned off.
Page 42 Enabling at least one processor from the STAND-BY MENU There are other resident PON tests to check other system resources. These tests are a subset of the SystemGuard maintenance offline tests, and reside within the flash EEPROM. These tests are divided into the following groups: BUMP Quick I/O Test Group These tests check the accessibility and the functions of the standard and direct I/O components from the BUMP: Async lines...
Page 43: Systemguard Parameters And Flags
Service contract flags These flags enable Service Console usage, maintenance usage and determine if dial-out messages are sent to IBM or to a Customer Service Center. These flags are stored in the SID (System Identification) field of the System EEPROM.
Page 44: Working With Systemguard
Working with SystemGuard SystemGuard parameters and flags may be changed from different locations. They can be changed from the SystemGuard STAND-BY MENU, the SystemGuard MAINTENANCE MENU, the Diagnostics interface, and also from AIX. When the key signal is received, SystemGuard clears the screen and displays the SystemGuard prompt.
Page 45: Systemguard Menus
When the system is in Stand-By mode and the System Key (Physical or Electronic Key) is in Service mode, the STAND-BY MENU can be accessed and SystemGuard executed. If you turn the system unit power on from Stand-By mode with the System Key in the Normal position, the system boots to AIX Multi-User.
Page 46 Stand-By Menu The STAND-BY MENU can only be entered when the system is in Stand-By mode (the word Stand-By must be displayed on the LCD display). Perform the following steps to bring up the STAND-BY MENU. 1. With Stand-By displayed on the LCD display press the Enter key on the BUMP console. The Stand-By prompt is the greater than (>) sign.
Page 47 How to Display the System Configuration The system configuration can be displayed through the STAND-BY MENU or through the MAINTENANCE MENU. Displaying Configuration through the Stand-By Menu This option displays the system configuration table. This configuration can be viewed on the LCD of the Operator Panel if the console is not configured.
Page 48 Display Configuration SIB14 PS04 SIB24 SIB15 PS05 SIB25 SIB16 PS06 SIB26 fc8e000000000000 SIB17 PS07 SIB27 D78605 19H0464 D78605 01 C fc8e000000000000 MCAe 01 C e1ff000000000000 02 C f48e000000000000 MCAe 02 C 708f000000000000 03 C fc8e000000000000 MCAe 03 C ec8f000000000000 04 C ffde000000000000 MCAe 04 C fc8e000000000000...
Page 49 CPUx EC+s: The agent status information of the CPU cards and the VPD information is given. MCx EC+s: This field gives the memory card VPD values. MCAx loc. code+status: This parameter contains the location code and the status information of the Micro Channel adapters (MCA). The contents of the 8 programmable option select (POS) registers are also displayed in the second column.
Page 50 and parameters (set during manufacturing), see the table in “Default Parameter Values” on page B-1 of the service guide for your system. The following flags can be managed: Remote Authorization: Only the local operator can enable this flag to enable remote maintenance to be performed.
Page 51 Set Configuration This menu option enables you to configure or unconfigure units and devices. 1. Enter 3 in the main menu to select this option. 2. You should then see a first-level screen similar to the following. It displays the units and devices that can be configured, along with their menu index number: Set Configuration 00 CPU0...
Page 52 SSBus Maintenance This option is used to investigate and check devices on the SSBus and is meant only for trained service personnel. Use this option to investigate and check devices on the SSBus. 1. Enter 4 in the main menu to select this option. SystemGuard displays the following menu, which allows you to read the time of day (TOD) registers and to read or write the non-volatile random access memory (NVRAM) and lines S1 and S2.
Page 53 C Maintenance Use this option to do maintenance operations on the I C buses of a selected unit, in order to investigate and check the connected devices. When exiting this menu, the previous status of the OP and SIB microcontrollers are restored (except for voltage margins). 1.
Page 54 Set voltage margins Note: This option can be only used for error analysis or factory test and must be used only by trained service personnel. Restore nominal voltage values before restarting other operations. Any data written on the disk in marginal mode must be removed before restarting normal operations.
Page 55: Maintenance Menu
Maintenance Menu The MAINTENANCE MENU also enables you to display the configuration of the system in a non-cryptic, easily understandable way, to perform various tests, to continue IPL either from network, a specific SCSI device or from the boot list, and to set flags concerning various system operation.
Page 56: Display Configuration
Display Configuration Use this option to view the system hardware configuration. This option provides different screens with the following levels of information: System-level information Unit-level information Device-level information. Enter 0 in the MAINTENANCE MENU to select the Display Configuration option. Display Configuration –...
Page 57 Voltage Margins for CPUs, ASICs, and other components. Device status information. Options to select various types of devices. DISPLAY CONFIGURATION – MAIN UNIT MARGINS VALUE: +5 VOLT –> Normal CPU (3.65 VOLT) –> Normal ASIC (3.6 VOLT) –> Normal SCSI DEVICES: Present –>...
Page 58 1. To see device-level information, enter the corresponding command number for the device. The device-level screen is displayed. 2. Enter x to return to the system-level configuration display screen. Display Configuration – Device Level This screen is shown when you select one of the devices of your choice from either the Main Unit or Unit 1 screen.
Page 59: Display Bump Error Log
Display BUMP Error Log Use this option to view the BUMP firmware error log. 1. Enter 1 in the MAINTENANCE MENU to select this option. The contents of the logging buffer are displayed as shown in the following screen: DISPLAY BUMP ERROR LOG EVENT # 1: 40140100000000000000000000000000000000000000000000000000000000000 00000000000000000000000000000000000000000000000000000000000000000...
Page 60: System Boot
System Boot This command enables you to begin boot activity. Enter 6 in the main menu to select this option. The following screen is displayed: SYSTEM BOOT 0> BOOT FROM LIST 1> BOOT FROM NETWORK 2> BOOT FROM SCSI DEVICE SELECT [x:exit]: The menu enables you to boot in three different ways: Enter 0 to boot from the normal or service boot list, after completing all the maintenance...
Page 61 2. Enter 1 to select the slot number. The system displays: SLOT# [1–7 (Internal Bus) | 1–8 (External Bus) or x: exit] Enter your choice. The displayed location code is updated. 3. Enter 2 to select the SCSI identification number. The system displays: SCSI ID [0–F or x: exit] Enter your choice.
Page 62: Off-Line Tests
Off-Line Tests Attention: These menus are only to be used when directed by service support personnel. Some of the tests described require test equipment or resources not available on your system. This option under the MAINTENANCE MENU enables you to run the off-line tests in a controlled and interactive mode.
Page 63 Displays the build test menu, which enables you to specify the test list (see “Build Test List” below). Displays and enables modification of the tests in the build list (see page 2-31). Deletes the tests in the build list, after operator confirmation. Attempting to delete tests from an empty list causes an error message to be displayed.
Page 64 3. Once you have selected the test groups, you can specify individual tests within a group. For example, the following screen enables you to specify individual BUMP Quick IO tests: BUILD TEST LIST GROUP 01 BUMP QUICK IO TEST DESCRIPTION TEST DESCRIPTION DEBUG LINE...
Page 65 Modify/Display Test List Once the test list is built, you can use this option to view or modify it. Each test is identified by a number xxyy , where xx is the group number and yy is the test number. 1.
Page 66: Set Parameters
Execute Test List This command enables you to run the test list once it is built (and possibly modified). All the tests in the test list are run one at a time with the selected execution options. Enter 3 in the OFF-LINE TESTS main menu to run the selected tests. The following screen displays the selected execution parameters for the test list.
Page 67 Power-On Command Parameters During the standby idle phase, the system power can be turned on (and the IPL started) by entering a BUMP console power-on string through line S1 or a service console power-on string through line S2 (see “Working with SystemGuard” on page 2-10 for a description of available keywords).
Page 68 Set Configuration This command is used to configure electronic boards like I/O cards or Micro Channel adapter (MCA) devices. 1. Enter 2 in the SET PARAMETERS menu to display the SET CONFIGURATION menu as shown below: SET CONFIGURATION 0> CPU CARD 1>...
Page 69 1. Enter 3 in the SET PARAMETERS menu to display the PHONE NUMBERS menu shown here: PHONE NUMBERS 0> SERVICE CENTER DIAL–OUT (1) –> 1> SERVICE CENTER DIAL–OUT (2) –> 2> CUSTOMER HUB DIAL–OUT (1) –> 3> CUSTOMER HUB DIAL–OUT (2) –> 4>...
Page 70 Enter 4 in the SET PARAMETERS menu to display the MISCELLANEOUS PARAMETERS menu. The value set for all the flags, except Fast IPL , is permanent until a new change is made. MISCELLANEOUS PARAMETERS 0> BUMP CONSOLE –> Present 1> AUTOSERVICE IPL –> Disabled 2>...
Page 71 2. The new flag status (opposite of the previous state) is displayed. Boot Multiuser AIX In Service Flag Enables multiuser AIX boots to proceed even if the Mode Switch is in the Service position (when booting by selecting option 6 in the MAINTENANCE MENU).
Page 72: Set National Language
Set National Language Use this option in the main menu to set the national language used for “SystemGuard”. Once selected, the effect is immediate and all the console messages are presented in the selected language. 1. Enter 9 in the MAINTENANCE MENU to select this option. The following menu is displayed: SET NATIONAL LANGUAGE 0>...
Page 73: Some Common Systemguard Tasks
Some Common SystemGuard Tasks The following tasks are done through the STAND-BY and MAINTENANCE MENUs that are part of SystemGuard. Note that these tasks can also be carried out from AIX diagnostics. How to Set the Electronic Key The key can be set electronically, making it easier to provide remote support without physically touching the machine.
Page 74 DISPLAY CONFIGURATION MACHINE TYPE/MODEL: 7013J30 45067 FIRMWARE RELEASE: Standby –> 1600 Backup eprom –> 0701 Flash eprom –> 0704 SERVICE CONTRACT: Last update (yymmdd) –> 950707 Validity –> Unlimited contract Remote service support –> Valid Quick On Call service –> Not valid AUTO DIAL: Disabled CONSOLES:...
Page 75 Setting Fast IPL through the Maintenance Menu 1. Enter the MAINTENANCE MENU. 2. Enter 8 to select the SET PARAMETERS menu. 3. Enter 4 from the SET PARAMETERS menu to select the MISCELLANEOUS PARAMETERS Menu. 4. Option 3 in this menu should show the current status of the Fast IPL flag. If it is disabled, simply enter 3, and the flag changes to enabled.
Page 76 How to Set the Service Line Speed By default, the service line speed is 1200 baud or 2400 baud depending on the level of SystemGuard. This speed can be changed through the SystemGuard MAINTENANCE MENU. In order to use the Service Console properly, the terminal connected to the S2 connector has to be set to the same speed.
Page 77 Setting Line Speed through AIX 1. With AIX up and running, log in as user root . 2. Type the following command to view current settings: mpcfg –dm The following is the output of the command: Index Name Value Modem Parameters File Name Service Line Speed Protocol Inter Data Block Delay Protocol Time Out...
Page 78 How to Set Up Console Mirroring Console Mirroring Concepts Console mirroring is a way to provide the customer a view of what the person working remotely from the Service Console is doing on the system. When mirroring is active, the Service Console and the BUMP Console are logically identical, and both are tty0 (tty1 is disabled when the mirroring starts).
Page 79 Setting Up Console Mirroring In order to setup console mirroring, you need first to authorize the Service Console, and set up the right line speed. Refer to previous chapters on how to set up the service line speed and how to authorize the Service Console. Then do the following: 1.
Page 80 How to Enable Surveillance Surveillance is implemented by the survd daemon. This daemon, when started, establishes a heartbeat between AIX and SystemGuard. In case of an AIX hang, SystemGuard detects it and reboots the system. To implement the surveillance, do the following: 1.
Page 81 Modem Configuration The modem on line S2 must be configured using an ASCII modem configuration file which describes various parameters using a specific syntax. AIX uses this file directly. SystemGuard uses the same information (in condensed form) stored in non-volatile memory (NVRAM).
Page 82 How to Reboot AIX from the Remote Service Console It is possible for the remote personnel connected via the Service Console to reboot AIX from the remote site. Prerequisites The following procedure must be carried out from the BUMP Console in order to allow AIX to boot remotely from the Service Console.
Page 83 Rebooting to Single-User and then to Multi-User This allows the remote support personnel connected to the system via a modem to the S2 port to shut down and reboot the system in Diagnostics mode for hardware diagnostics purposes. After running diagnostics, the remote personnel can reboot the system in AIX Multi-User without having a need to physically touch the machine.
Page 84 3. From this menu, enter 4. to select the MISCELLANEOUS PARAMETERS menu, which is similar to the following: MISCELLANEOUS PARAMETERS 0> BUMP CONSOLE –> Present 1> AUTOSERVICE IPL –> Disabled 2> DIAL_OUT AUTHORIZATION –> Disabled 3> FAST IPL –> Enabled 4>...
Page 85 10.At this point, a BOOT FROM SCSI DEVICE screen appears. This displays the PRESENT DEVICE LOCATION CODE. If it is not the device you want to boot from, go through each option and change it to the desired BUS, SLOT, SCSI ID, and LUN ID. Option 4 allows you to change all these options at once.
Page 86 How to Boot from the Network The system can be booted from the network through the MAINTENANCE MENU. Network boot allows a system to be reinstalled via the network and also allows various maintenance tasks to be carried out on the local machine. Use the following procedure to boot from the network: 1.
Page 87 5. The SELECT BOOT (STARTUP) DEVICE menu appears, which is similar to the following: SELECT BOOT (STARTUP) DEVICE Select the device to BOOT (Startup) this machine. WARNING: If you are using Token–Ring, selection of an incorrect data rate can result in total disruption of the Token–Ring network.
Page 88 7. Enter the appropriate IP addresses, and enter 99 to return to the MAIN MENU. A screen similar to the following appears: MAIN MENU Select BOOT (Startup) Device Select Language for these Menus Send Test Transmission (PING) Exit Main Menu and Start System (BOOT) Type the number for your selection, then press ”ENTER”...
Page 89 How to Disable and Enable Processors In the SMP servers, it is possible to disable/enable processors. A suspected faulty processor can be disabled so that the system can run without it. The processors can be disabled/enabled through the STAND-BY MENU, MAINTENANCE MENU, Diagnostics, or through AIX commands.
Page 90 5. Enter 04 to deconfigure CPU1. You should see the status changed to D, disabled. CPU1 | Status 00 CPU0 01 CPU0 02 CPU0 03 CPU1 04 CPU1 05 CPU1 Select(x:exit): 6. Now, once the system is rebooted, it runs without processor 1. 7.
Page 91 5. The CPU CARD screen appears and looks similar to the following: CPU CARD – (CPU1) PRESENT CONDITIONS: PR #0 –> Valid & Enabled PR #1 –> Valid & Enabled COMMANDS: 0> ENABLE 1> DISABLE 2> TEMPORARY DISABLE SELECT [x:exit]: 6.
Page 92: Customizing Systemguard For Your Needs
Customizing SystemGuard For Your Needs SystemGuard is controlled by several flags. The flags consist of Contract Flags, Operational Flags, Remote Maintenance Flags, and Test Flags. Remote Service Flag This flag is disabled at the factory and must be enabled for remote service Operational Flags The Operational Flags are the BUMP Console flag, the AutoService IPL flag, and Set Mode to Normal When Booting flag, which are enabled at the factory, however, they can be...
Page 93 Phone Numbers If remote maintenance is used, SystemGuard requires several phone numbers to be entered. Additional information is provided in “Phone Numbers” on page 2-34. Service Line Speed Parameters If remote maintenance is used, SystemGuard requires that the line speed be configured. The default is 1200 baud.
Page 94: Reloading The Flash Eeprom
Reloading the Flash EEPROM Follow this procedure to load a new version of SystemGuard into the flash EEPROM. Only system administrators should perform this procedure. Prerequisites To install a new version of the EEPROM firmware, you need either a firmware diskette containing a binary firmware image, or a file containing the firmware.
Page 95: Chapter 3. Maintenance Analysis Procedures (Maps)
Chapter 3. Maintenance Analysis Procedures (MAPs) MAP 1520: 7015 CPU Enclosure – Power MAP Note: This is not a start of call MAP. Use this Power MAP only if you have been directed here from a MAP step in the Diagnostic Information For Micro Channel Bus Systems .
Page 96 Power Supply Status If the system detects a power supply failure in the CPU enclosure, it turns the power off and displays service-request number (SRN) 409-Axy or 409-Bxy, where xy is the hexadecimal value of the power status register and gives some information about the power fault, as described in this MAP.
Page 97 Step 3 (from Step 2) Is the operator panel display illuminated? Go to Step 4. Go to Step 7. Step 4 (from Step 3) Check the LED on the System Interface Board. If the LED is on, it means that the power supply unit is supplying the Stand-By voltages.
Page 98 Step 6 (from Step 5) Note: Either the Power Supply or the power distribution cable cluster is defective. 1. Unplug both power supply power cords from both PDB outlet power cords. 2. Replace the power supply. Refer to the “Power Supply or Cooling Unit” removal procedure on page 4-61.
Page 99 Step 8 (from Step 2) Note: Stand-By should appear on the Operator Panel Display. Is Stand-By displayed on the Operator Panel Display? If an SRN is displayed, go to “MAP 0210: General Problem Resolution” in the Diagnostic Information For Micro Channel Bus Systems . If only a blinking cursor is displayed, record SRN 409-083 and go to “MAP 0210: General Problem Resolution”...
Page 100 Step 9 (from Step 8) 1. Set the power switch on the CPU Enclosure to On, with the key mode switch set to Service. 2. Find your symptom in the following table; then follow the instructions given in the Action column.
Page 101 Step 10 (from Step 1 and 9) The xy value in SRN 409-Axy or 409-Bxy is the hex value for the Power Status Register byte. Line 2 of the operator panel display identifies the unit that contains the error. The bits in the Power Status Register are defined as follows: 8 4 2 1 8 4 2 1 = Hex value of bits 7 6 5 4 3 2 1 0 = Bit numbering...
Page 102 Step 11 (from Step 10) An over temperature problem can be caused by an environmental problem (see Specifications in Chapter 1) or blocked air ducts. Check each of these items. Did you find the problem? Go to Step 12. Repair the problem. Go to “Map 0410: Repair Checkout” in the Diagnostic Information For Micro Channel Bus Systems .
Page 103: Map 1540: 7015 Cpu Enclosure - Minimum Configuration
MAP 1540: 7015 CPU Enclosure – Minimum Configuration Note: This is not a start of call MAP. You should use this MAP only if you have been directed here from a MAP step in the Diagnostic Information For Micro Channel Bus Systems .
Page 104 Step 1 (from Step 3, 6, 7, 9, 10, 17) 1. Ensure that the diagnostics and the operating system are shut down. 2. Turn the key mode switch to the Service Position. 3. Sometimes an SRN or Error Code will be logged in the BUMP Error Log. Before proceeding, check the BUMP Error Log for any SRNs or Error Codes.
Page 105 Note: Before verifying any condition indicated in the following steps of this MAP (for example, a certain code displayed on the operator panel display), be sure that the system activity has stopped on that condition (same condition for more than 3 minutes except for 165, which may display up to ten minutes with no activity on the BUMP console).
Page 106 Step 2 (from Step 1) 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters.
Page 107 Step 3 (from Step 2) One of the FRUs remaining in the CPU Enclosure is defective. To test each FRU, exchange the FRUs that have not already been exchanged in the following order: 1. I/O card (IOC) 2. CPU card (CPU) 3.
Page 108 Step 4 (from Step 2) No failure was detected with this configuration. 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3. Starting with the CPU cards, install one additional CPU card (CPU) or memory card (MC) (if any).
Page 109 Step 5 (from Step 4) The failure may be caused by the last CPU card (CPU) or memory card (MC) installed. To isolate the failing card, do the following: 1. Set the power button on the CPU Enclosure to Off. 2.
Page 110 Step 6 (from Step 5) One of the FRUs remaining in the CPU Enclosure is defective. To test each FRU, exchange the FRUs in the following order: System planar (SP) I/O card (IOC) CPU cards (CPU) Memory cards (MC) I/O planars CPU module flex cables I/O module flex cables 1.
Page 111 Step 7 (from Steps 1, 2, and 4) 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters.
Page 112 Step 8 (from Steps 7 and 17) The system is working correctly with this configuration. One of the adapters or devices that you removed is probably defective. 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3.
Page 113 Step 9 (from Step 8) 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3. Starting with the last installed adapter, disconnect one attached device and cable . 4.
Page 114 Step 10 (from Step 1) 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters.
Page 115 Step 11 (from Step 10) 1. Follow the instructions on the display to select your console. 2. When the Diagnostics Operating Instructions display, press the Enter key. 3. If the terminal type has not been defined or you are IPLing from CD-ROM, you must use the Initialize Terminal option on the FUNCTION SELECTION menu to initialize the AIX operating system environment before you can continue with the diagnostics.
Page 116 Step 13 (from Steps 19, 20, 21, 22) 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3. Record the location of all the internal SCSI devices attached to the SCSI bus you are attempting to IPL from.
Page 117 Step 14 (from Step 13) This problem can be caused by: – the CD-ROM pulling the bus down or opening the positive temperature coefficient (PTC) on the SCSI adapter – a defective SCSI adapter – a defective terminator – a defective SIB –...
Page 118 Step 16 (from Steps 14 and 15) In the following order, exchange the FRUs that have not been exchanged: 1. SCSI adapter 2. CD-ROM drive (if still in the system). 3. System interface board (SIB) 4. SCSI cable Test each FRU by trying to load diagnostics from CD-ROM if installed or disk.
Page 119 Step 17 (from Step 16) 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3. Record the slot numbers of the adapters. Label and record the location of any cables attached to the adapters.
Page 120 Step 18 (from Step 13) The system is working correctly with this configuration. One of the devices that you removed is probably defective. 1. Set the power button on the CPU Enclosure to Off. 2. Unplug both PDB outlet power cords from both power supply power cords. 3.
Page 121 Step 19 (from Step 1) This problem can be caused by: – a SCSI device pulling the bus down or opening the PTC on the SCSI adapter. – a defective SCSI adapter – a defective terminator – a defective system interface board (SIB) –...
Page 122 Step 20 (from Step 1) A message should be displayed with the flashing 269. Find the message in the table and do the listed action. Message Displayed Perform the Listed Action(s) 269 - NO BOOTABLE Go to Step 21. 269 - NO DEVICE Go to Step 13.
Page 123: Chapter 4. Removal And Replacement Procedures
Chapter 4. Removal and Replacement Procedures This chapter contains information about removing and replacing various field replaceable units (FRUs) and parts. The following illustration shows the three types of power distribution systems available in the Model R00 rack. Use the correct power-on and power-off procedure for the power distribution system in your rack.
Page 124: Power-Off Procedure With A Power Distribution Bus
Power-Off Procedure with a Power Distribution Bus Attention: Use the appropriate shutdown command before you stop the system unit; failure to do so may result in the loss of data. See your operating system documentation for information about the shutdown command. 1.
Page 125 Note: For a translation of this notice, see the System Unit Safety Information manual. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system. It is the responsibility of the customer to ensure that the outlet is correctly wired and grounded to prevent an electrical shock.
Page 126: Power-On Procedure With A Power Distribution Bus
Power-On Procedure with a Power Distribution Bus 1. Set the key mode switch to the Service position. Note: For a translation of this notice, see the System Unit Safety Information manual. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system.
Page 127: Power-Off Procedure With A Power Distribution Unit
Power-Off Procedure with a Power Distribution Unit Attention: Use the appropriate shutdown command before you stop the system unit; failure to do so may result in the loss of data. See your operating system documentation for information about the shutdown command. 1.
Page 128 Note: For a translation of this notice, see the System Unit Safety Information manual. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system. It is the responsibility of the customer to ensure that the outlet is correctly wired and grounded to prevent an electrical shock.
Page 129: Power-On Procedure With A Power Distribution Unit
Power-On Procedure with a Power Distribution Unit 1. Set the key mode switch to the Service position. Operator Panel Normal Secure Service Key Mode Switch Note: For a translation of this notice, see the System Unit Safety Information manual. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system.
Page 130 3. If the battery backup unit is installed, set the Master CB2 circuit breaker to On. 4. Set the Master CB1 circuit breaker to On. Rear View of Rack Battery Backup Unit Power Distribution Master Unit Master Power Distribution Unit 5.
Page 131: Power-Off Procedure With A Power Distribution Panel
Power-Off Procedure with a Power Distribution Panel Note: Notify the customer that you are going to switch off power to the attached 7015 CPU-Media Enclosure and to all of the disk drive drawers in the rack. Notify the customer that other attached systems might be affected by this procedure. Note: Before stopping the system unit, you must first shut down the operating system to prevent losing data.
Page 132 Note: For a translation of this notice, see the System Unit Safety Information manual. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system. It is the responsibility of the customer to ensure that the outlet is correctly wired and grounded to prevent an electrical shock.
Page 133: Power-On Procedure With Power Distribution Panel
Power-On Procedure with Power Distribution Panel 1. Set the key mode switch to the Service position. Operator Panel Power Button Normal Secure Service Key Mode Switch 4-11 Removal and Replacement Procedures...
Page 134 Note: For a translation of this notice, see the System Unit Safety Information manual. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system. It is the responsibility of the customer to ensure that the outlet is correctly wired and grounded to prevent an electrical shock.
Page 135 5. Ensure that all circuit breakers are on (circuit breaker switches in the up position). Front View of Power Distribution Panel Off Position On Position (Down) (Up) 6. Plug all external device power cords into the electrical outlets. 7. Switch on power to all external devices attached to the system unit. 8.
Page 136: Handling Static-Sensitive Devices
Handling Static-Sensitive Devices Attention: Adapters, boards, diskette drives, and disk drives can be damaged by electrostatic discharge. These devices are wrapped in antistatic bags to prevent this damage. Refer to the illustration. Take the following precautions: Do not remove the device from the antistatic bag until you are ready to install the device. If you have an antistatic wrist strap available, use it while handling the device.
Page 137: Front Bezel And Front Access Plate
Front Bezel and Front Access Plate Removal Note: For a translation of this notice, see the System Unit Safety Information manual, order number SA23-2652. CAUTION: This drawer is fixed and should not be moved for servicing. Attempting to move the drawer partially or completely out of the rack can turn over the rack or cause the drawer to fall out of the rack.
Page 138 3. To remove the front access plate, remove the seven retainer screws from the front of the CPU enclosure, and then remove the front access plate. Retainer Screws Front Access Plate Retainer Screws Replacement Note: Ensure that the grounding strips located around the edges of the front access plate are firmly attached and in place before replacing the front access plate.
Page 139: Disk Drive
Disk Drive Removal 1. Do the “Front Bezel and Front Access Plate” removal procedure on page 4-15. 2. Remove the mounting screw attaching the media retainer bracket to the CPU enclosure, and then remove the media retainer bracket. 3. Pull the disk drive toward you and out of the CPU enclosure. 4.
Page 140: Cd-Rom Drive Or Optional Media Device
CD-ROM Drive or Optional Media Device Removal Note: Observe the following safety notice before removing the CD-ROM drive. For a translation of this notice, see the System Unit Safety Information manual. CAUTION: A class 3 laser is contained in the device. Do not attempt to operate the drive while it is disassembled.
Page 141 5. If you are replacing only the CD-ROM drive or the optional media device and not the mounting bracket, disconnect the power and data connectors. 6. Remove the four mounting screws attaching the CD-ROM or optional media device to the mounting bracket, and then remove the CD-ROM drive or optional media device. CD-ROM Drive or Mounting Optional Media Device...
Page 142: Operator Panel
Operator Panel Removal 1. Depending on the power distribution in your rack, do one of the following: “Power-Off Procedure with a Power Distribution Bus” on page 4-2 “Power-Off Procedure with a Power Distribution Unit” on page 4-5 “Power-Off Procedure with a Power Distribution Panel” on page 4-9. 2.
Page 143: Lithium Battery
Lithium Battery Removal CAUTION: A lithium battery can cause fire, explosion, or a severe burn. Do not recharge, disassemble, heat above 100 C (212 F), solder directly to the cell, incinerate, or expose cell contents to water. Keep away from children. Replace only with the part number specified for your system.
Page 144 4. If a cable tie is holding the battery in position, cut the tie. The cable tie is for the original shipment of the unit and does not need to be replaced. Battery 5. If a battery cover is positioned over the battery, lift the battery cover off the battery. Battery Cover Battery...
Page 145: 3.5-Inch Diskette Drive
3.5-Inch Diskette Drive Removal 1. The 3.5-inch diskette drive is part of the operator panel subassembly. It is accessible from the upper side of the operator panel, after having removed it from the base unit. Remove the operator panel from the base unit, as described in “Operator Panel” on page 4-20.
Page 146 4. Disconnect the 3.5-inch diskette drive connector. 5. For later models, remove the two mounting screws attaching the diskette drive to the operator panel assembly, then remove the diskette drive from the operator panel assembly. 6. From the bottom of the diskette drive, remove the four mounting screws attaching the diskette drive to the diskette drive support.
Page 147: Operator Panel Bezel
Operator Panel Bezel Removal 1. Do the steps detailed in the removal procedure in “Operator Panel” on page 4-20. The operator panel bezel is then accessible from the upper side of the operator panel. 2. Remove the two mounting screws and clamps attaching the top cover to the operator panel assembly.
Page 148 4. Disconnect the two power connectors and the data connector. 5. For later models, remove the two mounting screws attaching the bezel to the operator panel assembly at the top corners of the operator panel assembly, and then remove the bezel.
Page 149: Media Module
Media Module Removal 1. Do the “Front Bezel and Front Access Plate” removal procedure on page 4-15. 2. Disconnect the following cables: Operator panel cable (push connector tabs away from the center of the connector) Media power cable. 3. Disconnect the SCSI cable: R30 and R40 media modules SCSI Cable Media Power Cable...
Page 150 R50 Media Module: Slide the media module toward you until you can access the bottom of the disk drive docking connector card, then remove the SCSI cable connector from the bottom of the docking connector card. R50 SCSI Cable Connector Bottom of Media Module Front of Media Module Rear of...
Page 151 4. Slide the media module toward you until you can place your hand under it, and then slide the media module out of the CPU enclosure. Front View of CPU Enclosure Media Module 5. Place the media module on a stable surface. Replacement Replace in the reverse order.
Page 152: Media Module Fans
Media Module Fans Removal 1. Do the “Media Module” removal procedure on page 4-27. 2. Disconnect the fan power cable for the fan you are removing. 3. Remove all four vibration isolators by pulling the fan either downward or away from the media module until the vibration isolators disengage from either the fan or the media module.
Page 153 Replacement To replace the vibration isolators when replacing a fan, do the following: 1. Check the direction of the air flow marked on the fan, and then place the long end of the vibration isolator through the mounting hole of the fan. 2.
Page 154: Media Module Cables And Docking Connector Cards
Media Module Cables and Docking Connector Cards Removal Notes: If you are removing the SCSI cable connected to the disk drive and media docking cards, perform steps 1, 2, 4, 5, 6, 7, 8, 9, 10, 11, and 12. If you are removing the operator panel cable that is not connected to a docking bracket, perform steps 2, 3, 4, 5, 7, 8, 9, 10, 11, and 18.
Page 155 7. Remove the disk drive fan and media fan. Refer to the “Media Module Fans” removal procedure on page 4-30 for information about removing the two fans. 8. Disconnect the SCSI cable connector on the rear of the disk drive docking connector card.
Page 156 11. Disconnect the SCSI cable connector on the media docking connector card. 12.Guide the SCSI cable out of the media module through the disk drive opening. 13.If you are removing either the docking connector card or the power cable assembly, disconnect the two power cable connectors (P75 and P76) from the docking connector card.
Page 157 15.If you are removing the docking connector card on the disk drive docking bracket, disconnect the power cable connector on the docking connector card. 16.Remove the two mounting screws attaching the docking bracket, and then guide the bracket through the rear of the media module. Mounting Screw Disk Drive Docking Bracket...
Page 158 18.If you are removing the operator panel cable for a media module that does not contain a docking connector card and bracket, remove the cable from the plastic cable retainers, and then guide the cable out of the media module through the operator panel position. Bottom View of Media Module Operator Panel Position (Front of Media Module)
Page 159 21.Remove the two mounting screws attaching the operator panel docking bracket to the bottom of the media module. 22.Remove the cable from the cable retainers, and then guide the cable out of the media module through the operator panel position. Bottom of Top View of Media Module Media Module...
Page 160 23.If you are removing the docking connector card and cable from the operator panel docking bracket, remove the four mounting screws, and then remove the card and cable. Docking Docking Bracket Connector Card Mounting Mounting Screws Screws 24.If you are removing the power cable assembly, perform the following substeps: a.
Page 161: Cpu Module
CPU Module Removal 1. Do the “Front Bezel and Front Access Plate” removal procedure on page 4-15. 2. Disconnect the operator panel cable and the media power cable, and then move the cables away from the front of the CPU module. Front View of CPU Enclosure Media Power Cable Operator Panel Cable...
Page 162 3. Remove the two retainer screws. 4. Loosen the docking screw until the CPU module is disengaged from the I/O planar interface connectors. 5. Grasp the front of the CPU module, and then pull the CPU module toward you until you can grasp the bottom of the CPU module on each side.
Page 163 Note: Make sure that the operator panel cable and the media power cable are placed out of the path of the CPU module. 6. While grasping the bottom of the CPU module on each side, pull the CPU module toward you until it is out of the CPU enclosure, and then place the CPU module on a stable surface.
Page 164 Replacement Note: When placing the CPU module in the CPU enclosure, make sure that the operator panel cable and the media power cable are placed out of the path of the CPU module. 1. Grasp the bottom of the CPU module with both hands and slowly slide it into the CPU Enclosure until the threaded tip of the docking screw touches the nut in the I/O module.
Page 165: Interlock Cable
Interlock Cable Note: Refer to “Handling Static-Sensitive Devices” on page 4-14 before removing or installing memory cards. Removal 1. Do the “CPU Module” removal procedure on page 4-39. 2. Remove the seven screws from the CPU module top cover, and then remove the top cover.
Page 166 – R50 CPU Enclosure: disconnect the interlock cable connector from the lateral planar 1 card, and then remove the interlock cable connector from the CPU-module frame. Lateral Planar 1 Card Interlock Cable Connector Replacement Replace in the reverse order. 4-44 Service Guide...
Page 167: Memory Card, Cpu Card, Or I/O Card
Memory Card, CPU Card, or I/O Card Note: Refer to “Handling Static-Sensitive Devices” on page 4-14 before removing or installing memory cards. Note: Removing the memory card, CPU card, or I/O card requires using the extraction tools. The extraction tools are stored on the left side of the front access plate. Removal 1.
Page 168 3. If you are removing the I/O card, disconnect both flex cables connected to the I/O card. 4. Locate the card you are removing and position the extraction tools: – R30 and R40 CPU enclosures: Position the single-piece extraction tool by placing the pin of the extraction tool through the hole in the top corner of the card you are removing.
Page 169 – R50 CPU Enclosure: Position single-piece extraction tools on either end of the card you are removing by placing the pin of the extraction tool through the hole in the top corner of the card you are removing. Flex Cable Connectors (on back of card) Single-Piece Memory...
Page 170 Replacement Notes: Install the memory cards in a right-to-left sequence beginning with slot A, and then continuing with slots B, C, and D. Memory cards must be installed with no empty slots between installed memory cards. Install the CPU cards in a right-to-left sequence beginning with slot P, and then continuing with slots Q, R, and S.
Page 171: Memory Modules
Memory Modules Removal 1. Remove the memory card from the CPU module, refer to the “Memory Card, CPU Card, or I/O Card” removal procedure on page 4-45. 2. Push the release tabs away from the memory module until the memory module disengages from the slot, and then remove the memory module.
Page 172: Cpu Module Fans
CPU Module Fans Removal 1. Do the “CPU Module” removal procedure on page 4-39. 2. Remove the cable tie holding the fan power cable connector. 3. Disconnect the fan power cable. 4. Remove all four vibration isolators by pulling the fan away from the media module until the vibration isolators disengage from either the fan or the media module.
Page 173 Replacement To replace the vibration isolators when replacing a fan, do the following: 1. Remove the module top cover and the I/O card, refer to the “Memory Card, CPU Card, or I/O Card” removal procedure on page 4-45. 2. Check the direction of the air flow marked on the fan, and then place the long end of the vibration isolator through the mounting hole of the fan.
Page 174: System Planar
System Planar Note: Refer to “Handling Static-Sensitive Devices” on page 4-14 before removing or installing memory cards. Removal 1. Do the “interlock Cable Connector” removal procedure on page 4-43. 2. Do the “Memory Card, CPU Card, and I/O Card” removal procedure on page 4-45 to remove all of the memory cards, CPU cards, and I/O card.
Page 175 If the CPU enclosure has a docking screw retention bracket, perform the next two steps. 4. Remove the screw holding the docking screw retention bracket. 5. Move the docking screw aside to provide access to the system planar mounting screws. Go to step 7.
Page 176 If the CPU module does NOT have a docking screw retention bracket, perform the next step. 6. For earlier versions of the CPU module, remove the docking screw by removing the two retainer clips and the three washers, and then remove the docking screw. Go to step 7.
Page 177 Replacement Note: Only nine mounting screws are required. If the system planar was installed with 11 mounting screws, two of them may be discarded. 1. Before replacing the system planar in the CPU module, perform the following: a. Thread all of the mounting screws into the system planar. b.
Page 178: Lateral Planar 1 Card
Lateral Planar 1 Card Note: Refer to “Handling Static-Sensitive Devices” on page 4-14 before removing or installing memory cards. Removal 1. To remove the lateral planar 1 card, perform the following removal procedures: a. The “CPU Module” removal procedure on page 4-39. b.
Page 179: Cpu Module Flex Cables
CPU Module Flex Cables Removal 1. Do the “CPU Module” removal procedure on page 4-39. 2. Remove the I/O card and all of the CPU cards. Refer to the “Memory Card, CPU Card, or I/O Card” removal procedure on page 4-45 to remove the I/O card and all of the CPU cards.
Page 180 5. Record the location of the flex cable connectors. 6. If you are removing the flex cable connected to the horizontal connector on the I/O card, remove the two large slotted mounting screws. If you are removing the flex cable connected to the vertical connector on the I/O card, remove the two guide pin mounting screws.
Page 181 8. Guide the flex cable you are removing over the connector mounting bracket, and then guide the I/O card connector end under the fan mounting bracket; remove the flex cable. Two Fans Are Shown Removed CPU Module Mounting Bracket Flex Cable Connectors Connector Mounting Bracket Replacement...
Page 182: Rear Access Plate
Rear Access Plate Removal 1. Depending on the power distribution in your rack, do one of the following: “Power-Off Procedure with a Power Distribution Bus” on page 4-2. “Power-Off Procedure with a Power Distribution Unit” on page 4-5. “Power-Off Procedure with a Power Distribution Panel” on page 4-9. 2.
Page 183: Power Supply Or Cooling Unit For Systems
Power Supply or Cooling Unit for Systems Attention: If your system has the capability to change power supplies while the system power is applied (R40, R50), see “Removal and Replacement While System Power is Applied” on page 4-62. Removal While System Power is Removed The power supply position farthest from the system interface board can contain either an optional power supply or a cooling unit.
Page 184 Replacement Attention: Ensure that you complete the replacement of the power supply before plugging in the power supply power cord. Plugging in the power cord before completing the power supply replacement can cause possible data loss. Replace in the reverse order. Removal and Replacement While System Power is Applied Attention: If system power must be removed before the power supply can be removed, see “Removal While System Power is Removed”...
Page 185 5. Tighten the mounting bolt of the new power supply. As you tighten the bolt the SIB LED turns off. When the bolt is sufficiently tightened, the SIB LED lights, the fans return to normal speed and the following messages appear: Note: These messages may take several minutes to appear.
Page 186: Power Supply Fan Or Cooling Unit Fan
Power Supply Fan or Cooling Unit Fan Removal 1. Do the “Rear Access Plate” removal procedure on page 4-60. 2. Disconnect the power cable connector for the power supply fan or the cooling unit fan you are removing. 3. Remove all four vibration isolators by pulling the fan away from the power supply or cooling unit until the vibration isolators disengage from either the fan, power supply, or cooling unit.
Page 187: System Interface Board (Sib)
System Interface Board (SIB) Attention: Lateral planar 2 and system interface board (SIB) EEPROMs contain the SYSID of the system. When one of the two components is to be replaced (for example the Lateral Planar 2), the SYSID information is copied from SIB EEPROM into the lateral planar 2 EEPROM when you start the system.
Page 188 Replacement Note: Before replacing the SIB in the I/O module, make sure the SIB is placed correctly on the guide rails. 1. Replace in the reverse order. 2. Depending on the power distribution in your rack, do one of the following Power-On procedures: “Power-On Procedure with a Power Distribution Bus”...
Page 189: I/O Module
I/O Module Removal 1. Depending on the type of power distribution in your rack, do one of the following: “Power-Off Procedure with a Power Distribution Bus” on page 4-2. “Power-Off Procedure with a Power Distribution Unit” on page 4-5. “Power-Off Procedure with a Power Distribution Panel” on page 4-9. 2.
Page 190 Note: The retainer screw on your right is also one of the retainer screws for attaching the system interface board in the I/O module. 7. Remove the remaining retainer screw. Retainer Screw Retainer Screw (Also Used for System Interface Board) 8.
Page 191 10.Slide the I/O module toward you until you can grasp the bottom of the I/O module on both sides, and then remove the I/O module from the CPU enclosure. 11. Place the I/O module on a stable surface. Rear of CPU Enclosure I/O Module Retainer Screw...
Page 192 Replacement 1. Grasp the bottom of the I/O module with both hands and slowly slide it into the CPU enclosure until the nut on the I/O module touches the tip of the docking screw on the CPU module. Note: The I/O module should easily slide into the CPU enclosure until it touches the docking screw.
Page 193: Lateral Planar 2 Card
Lateral Planar 2 Card Attention: After the lateral planar 2 card is installed and the system is powered–up, the system ID is down-loaded to the lateral planar 2 card from a backup source within the system. This ID becomes permanent on the lateral planar 2 and cannot be altered without special tools.
Page 194 4. Remove the system interface board. Refer to the “System Interface Board” removal procedure on page 4-65 for information about removing the system interface board. 5. Remove the five mounting screws. 6. Pull the lateral planar 2 card away from the side of the I/O module, and then remove the lateral planar 2 card from the I/O module.
Page 195: Adapter Cable
Adapter Cable Note: For a translation of this notice, see the System Unit Safety Information manual, form number SA23-2629. DANGER An electrical outlet that is not correctly wired could place hazardous voltage on metal parts of the system or the devices that attach to the system. It is the responsibility of the customer to ensure that the outlet is correctly wired and grounded to prevent an electrical shock.
Page 196 2. Record the location and label each adapter cable being removed. 3. To remove the adapter cable, do either of the following: a. If screws are used to connect the adapter cable connector to the adapter, loosen the two screws, and then remove the cable. b.
Page 197: Adapter
Adapter Note: Refer to “Handling Static-Sensitive Devices” on page 4-14 before removing or installing adapters. Removal 1. Remove the power supply or cooling unit located above the adapter you are removing. Refer to the “Power Supply or Cooling Unit” removal procedure on page 4-61. 2.
Page 198: I/O Module Flex Cables
I/O Module Flex Cables Removal 1. Perform the “I/O Module” removal procedure on page 4-67. 2. If you are removing the flex cable attached to the I/O planar 0, then remove the two guide pin mounting screws. If you are removing the flex cable attached to the I/O planar 1, then remove the two large slotted-head mounting screws.
Page 199: I/O Planar Power Cables
I/O Planar Power Cables Removal 1. Perform the “I/O Module” removal procedure on page 4-67. 2. If any adapters are located over the I/O planar power cables, do the “Adapter” removal procedure on page 4-75 to remove the adapters. Attention: To prevent damage to the flex cables it is important to remove the I/O Module Flex Cables before removing or replacing the I/O planar power cables.
Page 200: I/O Planars
I/O Planars Note: Refer to “Handling Static-Sensitive Devices” on page 4-14 before removing or installing the SIB. Removal 1. Perform the “I/O Module” removal procedure on page 4-67. 2. Do the “Adapter” removal procedure on page 4-75 to remove all of the adapters installed on the I/O planar you are removing.
Page 201: Power Distribution Cables
Power Distribution Cables Removal 1. Perform the “Power Supply or Cooling Unit” removal procedure on page 4-61 to remove the power supply and either the cooling unit or optional power supply. 2. Perform the “I/O Module” removal procedure on page 4-67. 3.
Page 202 Note: The docking connector mounting screws for the primary power supply, cooling unit, and optional power supply are located inside the I/O module. 5. If you are removing the power distribution cable for the optional power supply, remove the two mounting screws on the two optional power supply docking connectors, and then remove the power distribution cable.
Page 203: Chapter 5. Cpu Enclosure Installation Procedure
Chapter 5. CPU Enclosure Installation Procedure Note: The following statement applies to the CPU enclosure with power supplies or with a power supply and cooling unit installed. CAUTION: This unit weighs more than 55 kg (121.2 pounds). Material handling systems such as levers, slings, or lifts are required to safely move it.
Page 204 5. Remove the front bezel of the CPU enclosure. If you need more information to remove the front bezel, refer to the “Front Bezel and Front Access Plate” removal procedure on page 4-15. CAUTION: The unit weighs between 32 kg (70 pounds) and 55 kg (121.2 pounds). Three persons are required to safely lift the unit.
Page 205: Chapter 6. Parts Information
Chapter 6. Parts Information This chapter contains details showing all parts and the respective part numbers for each detail. Acronyms for FRU Parts Occasionally, an acronym is displayed with an SRN or Error Code on the LCD display to identify a failing FRU. The listing below defines the FRUs associated with the acronyms displayed.
Page 206: Detail 1. Front Bezel, Front Access Plate, And Cpu Enclosure
Detail 1. Front Bezel, Front Access Plate, and CPU Enclosure Service Guide...
Page 207 Units Index Part Number Number Assy Description 93H5056 Front bezel 11H3202 Logo 93H5078 Logo (R50) 11H7395 Front access plate (R30 and R40) 93H7089 Front access plate (R50) 11H3227 Warning label 00G1268 Screw, front cover mounting (M4x7) 11H7397 CPU enclosure 40H0502 Front access plate retainer bracket 32G1547 Screw...
Page 208: Detail 2. Disk Drives, Media Devices, And Operator Panel
Detail 2. Disk Drives, Media Devices, and Operator Panel Service Guide...
Page 209 Units Index Part Number Number Assy Description 96G4207 Lithium battery 94H9993 Operator panel assembly (1.44 MB with keylock) 88G4768 Diskette drive (1.44MB) 1622530 Screw (mounting screw) 11H3165 Retainer bracket 1621170 Screw (attaches to operator panel assembly) 00G1268 Screw (attaches to media module) 11H3143 Blank bezel 1622670...
Page 210: Detail 3. Media Module
Detail 3. Media Module 9, 8 Service Guide...
Page 211 Units Index Part Number Number Assy Description 11H7394 Media module (R30 and R40) 93H7119 Media module (R50) 11H3248 Retainer bracket (R30, R40) 93H5065 Retainer bracket (R50) 00G1268 Screw 78X8993 Screw 00G1268 Screw – Autodocking receiver mounting (M4x7 hex head) 40H0738 Operator panel receiver bracket assembly 11H8229 Stud...
Page 212: Detail 4. Cpu Module (1 Of 3)
Detail 4. CPU Module (1 of 3) Service Guide...
Page 213 Units Index Part Number Number Assy Description 11H2653 Top cover (part of CPU module assembly) (R30, R40) 93H5071 Top cover (part of CPU module assembly) (R50) 1621285 Screw 11H3280 Extraction tool (single-piece, two required for R50) 35H8748 CPU card, type C1D 601 processor (R30) 09J4712 CPU card, type C4D 604 processor (R40) 93H6274...
Page 214: Detail 5. Cpu Module (2 Of 3)
Detail 5. CPU Module (2 of 3) 6-10 Service Guide...
Page 215 Units Index Part Number Number Assy Description 65G6068 Lateral planar 1 (R30) 40H7013 Lateral planar 1 (R40 and R50) 04G1559 Screw 11H2678 Interlock cable 19H0242 System planar for R30 35H8778 System planar for R40 19H0035 System planar for R50 04G1559 Screw, hex head 1621187 Screw, pan head...
Page 216: Detail 6. Cpu Module (3 Of 3)
Detail 6. CPU Module (3 of 3) 6-12 Service Guide...
Page 217 Units Index Part Number Number Assy Description 93H7441 Front guide bracket assembly (R50) 93H7442 Rear guide bracket assembly (R50) 6-13 Parts Information...
Page 218: Detail 7. I/O Module
Detail 7. I/O Module 6-14 Service Guide...
Page 219 Units Index Part Number Number Assy Description See Note Adapter 40H0723 Flex cable (For I/O planar 1) 40H0727 Flex cable (For I/O planar 0) 11H2684 Power cable (long – I/O planar to SIB card) 11H2683 Power cable (short – I/O planar to SIB card) 40H0743 Lateral planar 2 (R30) 40H7014...
Page 220: Detail 8. Rails For Cpu Enclosure Installation
Detail 8. Rails for CPU Enclosure Installation Mounting Hardware For CPU Enclosure Detail A – Front of Rail Detail B – Rear of Rail 6-16 Service Guide...
Page 221 Units Index Part Number Number Description 02G7232 Rail, left 0375867 Nut clip 02G7295 Screw, rail mounting 1622320 Lock washer 1622405 02G7263 Rail, right 6-17 Parts Information...
Page 222: Power Cables
Power Cables Note: If you should need a different power cable, use this figure and the following table to assist you when ordering. Part Index Number Country 1838574 Bahamas, Barbados, Bolivia, Brazil, Canada, Costa Rica, Dominican Republic, El Salvador, Ecuador, Guatemala, Guyana, Haiti, Honduras, Jamaica, Japan, Netherlands Antilles, Panama, Peru, Philippines, Taiwan, Thailand, Trinidad, Tobago, U.S.A.
Page 223: Appendix A. Systemguard Test Groups
Appendix A. SystemGuard Test Groups SystemGuard Test Groups Table The following diagram shows the various test groups and their associated tests. To modify the test list, the tests have to be selected in the xxyy format, where xx is the group number and yy is the test number within the group.
Page 224 GROUP NO GROUP TEST NO TEST DCB and Memory MM Data lines Test test group MM Address lines Test MM board dec. Test MM Basic acc. Test MM components Test ECC component Test ECC mechanism Test Refresh mech. Test ECC Data lines access. Test MM Full Test (K/H) Interrupt test group BUMP to CPU interrupt Test...
Page 225: Systemguard Test Group Descriptions
SystemGuard Test Group Descriptions The following is a description of the different test groups and the tests available under them. All of these tests are performed automatically at Power On with default parameters. They can also be performed selectively (selection of test group/subtest/parameter) with user configured parameters, under the control of the Off Line Test monitor.
Page 226 BUMP, Remote, and Special Asynchronous Lines Test These tests are meant to check the Asynchronous lines of the Standard I/O and the Asynchronous Lines controller in the Super I/O. These tests contain sub-tests, which are described as follows. Each sub-test saves and restores the line parameters. When an error is detected, it is reported to the operator with a suitable error message.
Page 227 NVRAM Test This test checks the accessibility of NVRAM bytes. It contains the following sub-tests: NVRAM Data Lines Access Test This test saves the first NVRAM byte. Then a read / write operation is done word by word. It restores the first NVRAM byte. NVRAM Address Lines Access Test This test reads, writes and compares 2 NVRAM addresses.
Page 228 DTR Register Test This test writes, reads and compares a 1 among 0 bits in DTR registers. CTR Register Test This test writes, reads and compares a 1 among 0 bits in CTR registers. It saves and restores the CTR register value. Miscellaneous Registers Test This test checks accessibility to the MC68230 chip and its internal registers.
Page 229 Entry Parameters Parameters Name Definition Possible Values Default Value Parameter 1 Sub test # Subtest Number 0 or 1 0 = All tests linked Parameter 2 Proc # Processor Number 8 = BUMP Check–Sum Test It checks the CRC value for all present VPDs; It checks the CRC value according to the configuration and it checks the coherency of the configuration.
Page 230: Jtag Test Group
BPP External LoopBack Test (BPP EXT L–B TEST Note: This test can only be performed by Field or Manufacturing people. This test checks the accessibility of the Super–IO chip. It saves and restores used registers. This test is not performed at power on. Entry Parameters Parameters Name...
Page 231 IONIAN-SSGA Registers Test This test is performed by all the processors and it checks the accessibility from the processor to the IONIAN and SSGA chips. Following hardware parts are checked. 1. DCB ASIC 2. IONIAN ASIC 3. SSGA ASIC. The following sub-tests are included under the IONIAN-SSGA Registers Test: IONIAN Registers Test This test operates on the DSC register, CONFIG register, Personalization register, Bus_Status register.
Page 232 Super I/O and UART Access Test This test checks the accessibility of the Super I/O chip from the processors. They don’t check the functional aspects of the Super I/O chip (this is done by the BUMP directly). The following sub-tests are available under this test: Super I/O UART 1 Access Test Specific values are written and read in the data register scratch SCR.
Page 233: Cpu Test Group
SSGA Interrupt Registers Test This test writes and reads specific values from each of the interrupt registers. The values are then compared. Values are saved and restored in all the operations. Floppy Disk Access Test This test needs a formatted diskette in the diskette drive (the diskette content is erased by the test).
Page 234: Dcb And Memory Test Group
Level 2 cache. It calculates the memory address available and then validates the Level 2 cache before writing 1 MB. Then a read operation is done in word mode and values are compared. Then a read is done in burst mode and comparison is done. TAG Data Test This test checks the availability of the TAG chips of the L2 cache memory.
Page 235 Walking 0 Data Test This test isolates the open lines among the data lines. It writes “0s among 1s” pattern on the cache line. Then it is read and compared. Transfer Modes On DCB Test This sub-test is used to check the transfer of 1 to 8 bytes to the memory.
Page 236 This test consists of two sub-tests. Words manipulated / used are not restored at the end of the test. This test is applied to all the memory cards which are present. In case of errors, suitable error messages are displayed on the console. The following is a description of the sub-tests.
Page 237 Basic Main Memory Test This test is performed by all the processors and it checks the capability to access the main memory in all kinds of data formats. This test applies to one main memory location and the words used during the test are not restored. This test partially checks the DCB ASICs.
Page 238 Main Memory Components Test This test is performed by all the processors to check all the main memory locations. From the hardware point of view, this test checks the memory chips mounted on the main memory cards. This test can be launched in two modes, as follows: 1.
Page 239 ECC Data Lines Accessibility Test This test checks the accessibility for all the data lines to the ECC memory banks, through SMC ASICs. The following hardware parts are checked by running this test. DCB ASICs SMC ASICs Connection of data lines between CPU daughter boards and MPB ASICs Connection of data lines between MPB ASICs and ECC memory chips.
Page 240 ECC Memory Component Test This test is identical to the main memory components test but it is applied to the ECC memory components. Error Correction Mechanism Test This test checks the hardware mechanisms enabling the detection of and the correction of single bit errors when working with the main memory.
Page 241: Interrupt Tests Group
Interrupt Tests Group These tests are performed by the BUMP as well as the processors. They are launched at Power On and under control of Off Line Test Monitor. They collectively check the interrupt system. The following tests are available under this group. BUMP To CPU Interrupt Test This test is performed jointly by the BUMP and the processor.
Page 242: Cpu Multiprocessor Test Group
CPU MultiProcessor Test Group These tests are launched at Power-On and are also available under the control of the Off Line Tests monitor. These tests check the multi-processor mechanisms, atomic instructions, cache coherency, main memory sharing, and multi-resources sharing. The following tests are available under this group. Atomic Instructions Test This test checks the mechanisms enabling the protection of the content of the memory in case of use of some specific instructions, called “atomic instructions”.
Page 243 instruction. This is issued by Processor 0 which is set to Global Copy Back mode. Caching is inhibited for Processor 1. Paradox Detection: DCBST not from Line Owner Here, Processor 1 is set to Local Copy Back mode. Memory coherency is enabled for Processor 0. This test verifies the incoherency introduced by the Local Copy Back.
Page 244 Main Memory Sharing Test This test is launched by the BUMP and performed by all configured processors. It has a sub-test to check the capability of all the processors to access the main memory. The following hardware parts are checked during the process: 1.
Page 245: Appendix B. Modifying Systemguard Parameters
Appendix B. Modifying SystemGuard Parameters Many SystemGuard parameters can be modified in several ways. Some can be modified using the SystemGuard Stand-By menu, others using the SystemGuard Maintenance menu, and others using the AIX diag or mpcfg commands or Diagnostic Service Aids. When you want to modify SystemGuard parameters, the method to use depends on the machine boot phase (stand-by, init, run-time).
Page 246 Flag, Parameter and Keyword Default Values Name Default Value BUMP Console Power-On Command String Power Service Console Power-On Command String Blank (not set) BUMP Console Power-On Command flag Enabled Service Console Power-On Command flag Disabled Remote Authorization flag Disabled Autoservice IPL flag Disabled BUMP Console Present flag Enabled...
Page 247: Changing Flags And Parameters Under Aix Service Aids
Changing Flags and Parameters Under AIX Service Aids The Service Aids are recommended to change the flags. The Service Aids can be entered using the diag command or by booting diagnostics in service mode. They display or change flag values using 0 (zero) for disabled and 1 (one) for enabled. The explanations that follow refer to the Service Aids.
Page 248: Modifying The Dial-Out Authorization Flag
SystemGuard Maintenance Menu Starting from the main maintenance menu: Enter 2 to enable the flag. Enter 3 to disable the flag. AIX Diag Command Starting from the Service Aids Selection menu: 1. Select the BUMP Service Aids option. 2. Select the Display or Change Flags and Configuration option. 3.
Page 249: Modifying Dial-In Phone Numbers
Modifying Dial-In Phone Numbers These parameters can be changed under SystemGuard using the maintenance menu, or under AIX using the diag command. SystemGuard Maintenance Menu Starting from the main maintenance menu: 1. Enter 8 to set parameters. 2. Enter 3 for phone numbers. 3.
Page 250: Modifying The Electronic Mode Switch From Service Line Flag
Modifying the Electronic Mode Switch from Service Line Flag This flag can be changed under SystemGuard using the maintenance menu, or under AIX using the diag command. SystemGuard Maintenance Menu Starting from the main maintenance menu: 1. Enter 8 to set parameters. 2.
Page 251: Reloading The Flash Eeprom
Reloading the Flash EEPROM Follow this procedure to load a new version of SystemGuard into the flash EEPROM, which may be necessary when you install a new version of AIX for example. Only system administrators should perform this procedure. Prerequisites If the system is not yet booted, you need a firmware diskette containing the new version of the firmware to be loaded.
Page 252 Installation and Service Guide...
Page 253: Appendix C. Systemguard Remote Operation Configuration
Appendix C. SystemGuard Remote Operation Configuration In order to utilize the remote operation capabilities of SystemGuard and also allow console mirroring, you need to have flags, parameters and tty configurations properly enabled. Below, are tty0 and tty1 settings, sample modem files and all the parameters that are necessary to allow remote operations.
Page 254: Flags And Parameters Settings
The configuration of the tty1 for the S2 port looks similar to the following: [TOP] [Entry Fields] tty1 TTY type TTY interface rs232 Description Asynchronous Terminal Status Available Location 00–00–S2–00 Parent adapter PORT number [s2] Enable LOGIN disable BAUD rate [9600] PARITY [none]...
Page 255 Customer Hub Dial–Out (2) System Dial–In System Operator Voice The phone number in the Service Center Dial-Out field represents the U.S IBM RETAIN number. It should be set as appropriate to the geography. Other phone numbers should be provided based on account-related information.
Page 256: Modem Configuration Files
The configuration files for the IBM 7851 are shown below. This file has a very specific format. You can use this file as a template to build a configuration file for another model of modem.
Page 257 This is a sample /usr/share/modems/mir_modem file for console mirroring using an IBM 7851 modem. # Tested at 9600bps. ICDelay 5 DefaultTO 10 CallDelay 120 Attention Code Enable result codes to screen # &F1 Set factory profile 1 Disable result codes to...
Page 258: Initializing A Modem
Initializing a Modem Once flags, parameters and configurations have been enabled, the modem can be initialized to accept incoming calls. This can be done in the following manner: Place the System Key to Normal. Issue a ps –ef|grep mirrord command. Obtain mirrord process ID.
Page 259: Appendix D. Off Line Diagnostic Error Codes
Appendix D. Off Line Diagnostic Error Codes Note: The Failure Percent value is calculated on a system model base. As some Failing Function Codes are system model specific but are associated the the same Error Number, it may happen that the sum of the Failure Percent values in one single box exceeds 100.
Page 260 Failing Failure Error Function Percent Number Source Codes Description 401-023 Description: S2 asynchronous line junction signal error (DTR to DSR link). Action: Use MAP 0210. 401-024 Description: S2 asynchronous line junction signal error (RTS to CTS link). Action: Use MAP 0210. 401-025 Description: S2 asynchronous line junction signal error (OUT2 to DCD link).
Page 261 Failing Failure Error Function Percent Number Source Codes Description 401-049 Description: S3 asynchronous line junction signal error (DTR to DSR link). External loop-back mode. Action: Use MAP 0210. 401-050 Description: S3 asynchronous line speed error. External loop-back mode. Action: Use MAP 0210. 401-060 Description: Flash EPROM standard area checksum error.
Page 262 Failing Failure Error Function Percent Number Source Codes Description 401-140 all boards Description: Bad VPD Board. 401-141 all boards Description: No Board present. 401-142 all boards Description: No coherent configuration on board. 401-150 Description: Asynchronous lines access. Line Sx: register error Action: Use MAP 0210.
Page 263 Failing Failure Error Function Percent Number Source Codes Description 401-182 Description: DIAL-OUT test. No customer Hub or Service Center Modem phone Dial-Out. 401-183 Description: DIAL-OUT test. Modem parameters failed. Modem 401-184 Description: DIAL-OUT test. Line busy. Modem 401-185 Description: DIAL-OUT test. Connection Time out. Modem 401-186 Description: DIAL-OUT test.
Page 264 Failing Failure Error Function Percent Number Source Codes Description 401-514 Description: Direct IO: IONIAN-SSGA. APR register error. Action: Use MAP 0210. 401-515 Description: Direct IO: IONIAN-SSGA. BSR init value. Action: Use MAP 0210. 401-516 Description: Direct IO: IONIAN-SSGA. MD0 init value. Action: Use MAP 0210.
Page 265 Failing Failure Error Function Percent Number Source Codes Description 401-550 Description: Direct IO. Flash Eprom access error. Action: Use MAP 0210. 401-560 Description: Direct IO. Eprom access error. Action: Use MAP 0210. 401-570 Description: Direct IO. TOD imbedded RAM access error. Action: Use MAP 0210.
Page 266 Failing Failure Error Function Percent Number Source Codes Description 401-591 Description: Diskette drive access. Error on sense interrupt command. Action: Use MAP 0210. 401-592 Description: Diskette drive access. Error on write command. Action: Use MAP 0210. 401-593 Description: Diskette drive access. Error on read command.
Page 267 Failing Failure Error Function Percent Number Source Codes Description 401-807 Description: Channel reset and POS. Missing DMA interrupt error during transfer. Action: Use MAP 0210. 401-808 Description: Channel reset and POS. DMA status error. Action: Use MAP 0210. 401-809 Description: Channel reset and POS. Missing DMA interrupt error after transfer.
Page 268 Failing Failure Error Function Percent Number Source Codes Description 401-824 Description: Channel reset and POS. SCSI Bus control lines error. Action: Use MAP 0210. 401-825 Description: Channel reset and POS. Missing ACK signal error. Action: Use MAP 0210. 401-826 Description: Channel reset and POS. Pending ACK signal error.
Page 269 Failing Failure Error Function Percent Number Source Codes Description 401-841 Description: Channel reset and POS. POS4 register error. Action: Use MAP 0210. 401-842 Description: Channel reset and POS. POS2 register error. Action: Use MAP 0210. 401-843 Description: Channel reset and POS. NCR SCRATCH A register error.
Page 270 Failing Failure Error Function Percent Number Source Codes Description 401-851 Description: Channel reset and POS. Buffer exchange error. Action: Use MAP 0210. 401-852 Description: Channel reset and POS. LSA board not responding. Action: Use MAP 0210. 402-000 Description: CPU processor error. Action: Use MAP 0210.
Page 271 Failing Failure Error Function Percent Number Source Codes Description 402-110 Description: Caches coherencies. Concurrent coherent write accesses error. Action: Use MAP 0210. 402-111 Description: Caches coherencies. Concurrent not coherent write accesses error. Action: Use MAP 0210. 402-112 Description: Caches coherencies. DCBST from line owner error.
Page 272 Failing Failure Error Function Percent Number Source Codes Description 402-132 Description: DCB ports arbitration error. Memory coherency error. Action: Use MAP 0210. 402-133 Description: DCB ports arbitration error. Odd processor DCBF or even processor read error. Action: Use MAP 0210. 402-134 Description: DCB ports arbitration error.
Page 273 Failing Failure Error Function Percent Number Source Codes Description 402-530 Description: CPUs to CPUs interrupt error. Even processors auto interrupt. Action: Use MAP 0210. 402-531 Description: CPUs to CPUs interrupt error. Odd processors auto interrupt. Action: Use MAP 0210. 402-532 Description: CPUs to CPUs interrupt error.
Page 274 Failing Failure Error Function Percent Number Source Codes Description 403-013 Description: Main Memory address lines accessibility error. Unexpected interrupt. Action: Use MAP 0210. 403-020 Description: Main memory board address accessibility error. Write all 0 and 1 error. Action: Use MAP 0210. 403-021 Description: Main memory board address accessibility error.
Page 275 Failing Failure Error Function Percent Number Source Codes Description 403-038 Description: Main memory basic tests error. Work mode main memory addressing error. Action: Use MAP 0210. 403-039 Description: Main memory basic tests error. Aligned multi-store error. Action: Use MAP 0210. 403-040 Description: Main memory basic tests error.
Page 276 Failing Failure Error Function Percent Number Source Codes Description 403-074 Description: Error correction code mechanism. B96 or Multiple Error generation error. Action: Use MAP 0210. 403–075 Description: DCB or SMC error. Multiple Error generation error. Action: Use MAP 0210. 403-080 Description: Main Memory refresh mechanism.
Page 277 Failing Failure Error Function Percent Number Source Codes Description 403-506 Description: BUMP to CPU interrupt error. IOD-HW-STS register error. Action: Use MAP 0210. 403-507 Description: BUMP to CPU interrupt error. IRR register error. Action: Use MAP 0210. 403-508 Description: BUMP to CPU interrupt error. No external interrupt.
Page 278 Failing Failure Error Function Percent Number Source Codes Description 403-527 Description: CPU to BUMP interrupt. XIRR4 register error. Action: Use MAP 0210. 403-528 Description: CPU to BUMP interrupt. IOD-HW-STS register error. Action: Use MAP 0210. 403-529 Description: CPU to BUMP interrupt. XIRR0 register error.
Page 279 Failing Failure Error Function Percent Number Source Codes Description 403-555 Description: CPU to CPU interrupt. XIRR register error. Action: Use MAP 0210. 403-560 Description: TOD to BUMP interrupt. Unexpected interrupt error. Action: Use MAP 0210. 403-561 Description: TOD to BUMP interrupt. No trap interrupt.
Page 280 Failing Failure Error Function Percent Number Source Codes Description 404-018 Description: Caches coherencies. DCBI not from line owner error. Action: Use MAP 0210. 404-019 Description: Caches coherencies. DCBT not from line owner error. Action: Use MAP 0210. 404-020 Description: DCB arbitration mechanism error. Action: Use MAP 0210.
Page 281 Failing Failure Error Function Percent Number Source Codes Description 407-015 Description: CPU interrupt test manager stopping T-O. Action: Use MAP 0210. 407-016 Description: CPU multi-processor test manager launching T-O. Action: Use MAP 0210. 407-017 Description: CPU multi-processor test manager stopping T-O. Action: Use MAP 0210.
Page 282 Failing Failure Error Function Percent Number Source Codes Description 408-060 Description: Main memory Knaizuk-Hartmann test error. B96 or Action: Use MAP 0210. 408-080 Description: Multi resources full test error. Action: Use MAP 0210. 409-000 Description: Planar vital part FATAL ERROR. Action: Use MAP 0210.
Page 283 Failing Failure Error Function Percent Number Source Codes Description 409-083 Description: OP microcontroller not working. Action: Use MAP 0210. 409-087 Description: MVR not compatible with the CPU boards. Action: Use MAP 0210. 409-088 Description: Different cycle time between the present CPU boards.
Page 284: Error Logging
Error Logging When a failure occurs on a fan or on a power supply, the system produces a logging report for this event. The logging report can be viewed using errpt . An errpt report about power and fan is the following: LABEL: EPOW_SUS Description:...
Page 285 1010 Fan 2 fault 1011 Fan 3 fault 1100 Fan 4 fault 1100 Fan 5 fault 1100 Fan 6 fault 1111 Reserved Power Up Bits 4–6 Values Description Manual On button pushed Remote On signal from external Timed power on from TOD clock Remote on signal from power control interface Automatic restart Power Up...
Page 286 Power System Operating in Backup Mode Bit 14 Values Description No power warning Power system operating in backup mode warning Cooling System Operating in Backup Mode Bit 15 Values Description No cooling warning Cooling system operating in backup mode warning Power Fault and Fan Fault (R30, R40, and R50) Bits 16–23 values Description...
Page 287 Understanding PKSR The PKSR status is logged in hexadecimal value: 8 digits are logged. Each hexadecimal digit must be converted in 4 binary digits: 32 bits are obtained. Divide the bits as indicated in the PKSR layout and check the bit values to understand the meaning of the register. Example Suppose you receive an error message whose PKSR content in hex is: 9005 0007...
Page 288 D-30 Service Guide...
Page 289: Appendix E. System Power States
Appendix E. System Power States The state of the system is dependant on the condition of four variable conditions that effect how the system IPLs or shuts down. The four conditions are: the position of the Power-on button This button has two positions. It can be pressed in to the On position (position for turning the power on), or it can be in the out or Off position.
Page 290 If the command sbb is entered on the BUMP console, and the system key is in the Normal position, the system goes to the SBB_ECMD state. If the Power-on button is pressed and changes from the On position to the Off position, the system sets the was_shutdown status to false.
Page 291 If the power_fault status is false, the system attempts to power on. If the system then detects a power fault, the power_fault status is set to true. The system displays an operator panel LCD error message, and the system goes to the MAIN_STANDBY status. If no power fault is detected, the system goes to the IPL state.
Page 292 If the system power does not turn on, the Power-on button may be in the off position. Go to the system unit and press the Power-on button (only press the button once), If the system power still does not turn on there may be an earlier fault condition. Remove main power from the system unit, wait 30 seconds, and restore main power.
Page 293: Glossary: Special Terms Used In Systemguard
Glossary: Special Terms Used in SystemGuard BP (back plane). A panel located in the system I/O card. A card which handles system I/O and unit and used to interconnect boards and devices. directly connects to the system planar. BIST (built in self-test). Tests performed during IPL (initial program load).
Page 294 which can be removed without turning the power off such as the EEPROM, the flash EEPROM, and the to the entire system). non-volatile RAM. ROS (read-only storage). Storage which does not SSF (system service facility). See SystemGuard. support writing. SYSID (system identification). Identifies part of SCSI (small computer system interface).
Page 295: Index
Index Numbers typical rail installation, 1-16 CPU enclosure – minimum configuration, 3-1540-1 -48 V dc power supply CPU enclosure – power MAP, 3-1520-1 power-off procedure with power distribution cpu installation, 5–1 panel, 4-9 power-on procedure, 4-11 CPU module fans, 4-50 CPU module, 1-5, 4-39, 6-8, 6-10, 6-12 media module, 1-7 CPU module flex cables, 4-57...
Page 296 media module internal cables, 4-32 memory card, 4-45 handling static-sensitive devices, 4-14 memory card, CPU card, I/O card, 4-45 hardware components, CPU module, memory memory SIMM, 4-49 cards, 1-9 minimum configuration MAP, 3-1540-1 modifying SystemGuard parameters, B-1 I/O card, 4-45 I/O module, 1-6, 4-67, 6-14 off line diagnostics, error codes, D-1 I/O module flex cables, 4-76...
Page 297 power-off with a power distribution bus, 4-2 power-off procedure with a power distribution panel, 4-9 power-on from BUMP console, E-3 power-off with a power distribution bus, 4-2 power-on procedure with power distribution panel, power-on procedure with a power distribution 4-11 unit, 4-7 power-on procedure with power distribution power-on using the power-on button, E-4...
Page 298 electronic mode switch, modifying, B-6 Maint to Boot, 2-9 flags, 2-9 maintenance, 2-5 flash EEPROM, reloading, B-7 run-time, 2-5 maintenance menu, 2-21 stand-by, 2-4 disable service console, 2-25 stand-by to init, 2-6 display BUMP error log, 2-25 physical key, 2-4 display configuration, 2-22 power, 2-2 device level, 2-24...
Page 300 Printed in the U.S.A. SA23-2743-02...

This manual is also suitable for:

7015-r40 7015-r30

IBM 7015-R50 Installation And Service Manual

Communications Statements

Safety Notices

About this Book

Chapter 1. Reference Information

Chapter 2 Using Systemguard

Chapter 3. Maintenance Analysis Procedures (Maps)

Chapter 4. Removal and Replacement Procedures

Chapter 5. CPU Enclosure Installation Procedure

Chapter 6. Parts Information

Appendix A. Systemguard Test Groups

Appendix B. Modifying Systemguard Parameters

Appendix C. Systemguard Remote Operation Configuration

Appendix D. off Line Diagnostic Error Codes

Appendix E. System Power States

Glossary: Special Terms Used in Systemguard

Index

Quick Links

Related Manuals for IBM 7015-R50

Summary of Contents for IBM 7015-R50

This manual is also suitable for:

Table of Contents