10. SERVICE MODE
DIPSW No. Bit
DipSW18
0
1
2
3
4
5
6
7
DipSW19
0
1
2
3
4
5
6
7
DipSW20
0
1
2
3
4
5
6
7
274
1
Function
Separation of a defective part
from the tray 1 (upper stage of
the main body)
Separation of a defective part
from the tray 2 (lower stage of
the main body)
Separation of a defective part
from the bypass feed
—
Separation of a defective part
from the tray 3 (PC-206 upper
stage/PC-407)
Separation of a defective part
from the tray 4 (PC-206 lower
stage)
Separation of a defective part
from the tray 5 (LU)
—
Separation of a defective part
from the printer controller (IC)
Separation of a defective part
from the FAX kit (FK)
—
Separation of a defective part
from HDD
—
Separation of a defective part
from the scanner
—
Separation of a defective part
from DF
Separation of a defective part
from the network
Separation of a defective part
from IEEE1284
Separation of a defective part
from USB
—
—
Separation of a defective part
from SD
—
—
Field Service Ver.2.0 Mar. 2009
0
1
Normal
Separated
Normal
Separated
Normal
Separated
—
—
Normal
Separated
Normal
Separated
Normal
Separated
—
—
Normal
Separated
Normal
Separated
—
—
Normal
Separated
—
—
Normal
Separated
—
—
Normal
Separated
Normal
Separated
Normal
Separated
Normal
Separated
—
—
—
—
Normal
Separated
—
—
—
—
Default setting
Japan
Inch
Metric
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0