Mechanical Specifications; Package Mechanical Drawings; Processor Package Assembly Sketch - Intel Quad-Core Xeon Datasheet

Mechanical Specifications

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Mechanical Specifications
The Quad-Core Intel® Xeon® Processor 5300 Series are packaged in a Flip Chip Land
Grid Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket.
The package consists of two processor dies mounted on a pinless substrate with 771
lands. An integrated heat spreader (IHS) is attached to the package substrate and core
and serves as the interface for processor component thermal solutions such as a
heatsink.
they are assembled together. Refer to the LGA771 Socket Design Guidelines for
complete details on the LGA771 socket.
The package components shown in
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor Die
• Package Substrate
• Landside capacitors
• Package Lands
Figure 3-1.

Processor Package Assembly Sketch

System Board System Board
Note: This drawing is not to scale and is for reference only.
3.1

Package Mechanical Drawings

The package mechanical drawings are shown in
drawings include dimensions necessary to design a thermal solution for the processor
including:
• Package reference and tolerance dimensions (total height, length, width, and so
forth)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keepout dimensions
• Reference datums
Note: All drawing dimensions are in mm [in.].
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Figure 3-1 shows a sketch of the processor package components and how
Core (die) Core (die)
IHS IHS
Substrate Substrate
Package Lands Package Lands
Figure 3-1 include the following:
TIM TIM
Capacitors Capacitors
Figure 3-2
LGA771 Socket LGA771 Socket
through Figure 3-4. The
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