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3.4
Package Handling Guidelines
Table 3-2
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Table 3-2.
Package Handling Guidelines
Parameter
Shear
Tensile
Torque
Notes:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4.
These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5.
Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5
Package Insertion Specifications
The Quad-Core Intel® Xeon® Processor 5300 Series can be inserted and removed 15
times from an LGA771 socket, which meets the criteria outlined in the LGA771 Socket
Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the Quad-Core Intel® Xeon® Processor 5300 Series is 21.5 g
(0.76 oz). This includes all components which make up the entire processor product.
3.7
Processor Materials
The Quad-Core Intel® Xeon® Processor 5300 Series are assembled from several
components. The basic material properties are described in
Table 3-3.
Processor Materials
Integrated Heat Spreader (IHS)
Substrate
Substrate Lands
52
includes a list of guidelines on a package handling in terms of recommended
Maximum Recommended
3.95
Component
Units
311
70
111
25
N-m
35
LBF-in
Material
Nickel over copper
Fiber-reinforced resin
Gold over nickel
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Mechanical Specifications
Notes
N
1,4,5
lbf
N
2,4,5
lbf
3,4,5
Table
3-3.
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