Sign In
Upload
Manuals
Brands
Intel Manuals
Computer Hardware
Quad-Core Xeon 5300 Series
Intel Quad-Core Xeon 5300 Series Manuals
Manuals and User Guides for Intel Quad-Core Xeon 5300 Series. We have
3
Intel Quad-Core Xeon 5300 Series manuals available for free PDF download: Datasheet, Design Manual
Intel Quad-Core Xeon 5300 Series Datasheet (124 pages)
5300 Series
Brand:
Intel
| Category:
Computer Hardware
| Size: 4 MB
Table of Contents
Table of Contents
3
1 Introduction
9
Quad-Core Intel® Xeon® Processor 5300 Series Features
10
Terminology
11
State of Data
13
References
13
2 Electrical Specifications
15
Front Side Bus and GTLREF
15
Power and Ground Lands
16
Decoupling Guidelines
16
VCC Decoupling
16
VTT Decoupling
16
Front Side Bus AGTL+ Decoupling
17
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
17
Front Side Bus Frequency Select Signals (BSEL[2:0])
18
Core Frequency to FSB Multiplier Configuration
18
BSEL[2:0] Frequency Table
18
PLL Power Supply
19
Voltage Identification (VID)
19
Voltage Identification Definition
20
Reserved, Unused, or Test Signals
21
Loadline Selection Truth Table for LL_ID[1:0]
21
Market Segment Selection Truth Table for MS_ID[1:0]
21
Front Side Bus Signal Groups
22
FSB Signal Groups
22
AGTL+ Signal Description Table
23
Non AGTL+ Signal Description Table
23
Signal Reference Voltages
23
CMOS Asynchronous and Open Drain Asynchronous Signals
24
Test Access Port (TAP) Connection
24
Platform Environmental Control Interface (PECI) DC Specifications
24
DC Characteristics
24
PECI DC Electrical Limits
24
Input Device Hysteresis
25
Mixing Processors
25
Absolute Maximum and Minimum Ratings
26
Processor Absolute Maximum Ratings
26
Processor DC Specifications
27
Flexible Motherboard Guidelines (FMB)
27
Voltage and Current Specifications
27
Quad-Core Intel® Xeon® Processor E5300 Series Load Current Versus Time
30
Quad-Core Intel® Xeon® Processor X5300 Series and Load Current Versus Time
30
Quad-Core Intel® Xeon® Processor X5365 Series Load Current Versus Time
31
Quad-Core Intel® Xeon® Processor L5300 Series Load Current Versus Time
31
Quad-Core Intel® Xeon® Processor L5300 Series
31
Quad-Core Intel® Xeon® Processor L5318 Load Current Versus Time
32
E5300 Series, Quad-Core Intel® Xeon® Processor X5300 Series
32
Quad-Core Intel® Xeon® Processor E5300 Series VCC Static and Transient Tolerance Load Lines
33
Transient Tolerance Load Lines
33
Quad-Core Intel® Xeon® Processor X5300 Series VCC Static and Transient Tolerance Load Lines
34
Quad-Core Intel® Xeon® Processor L5300 Series VCC Static and Transient Tolerance Load Lines
35
Transient Tolerance Load Lines
35
VCC Overshoot Specification
40
Open Drain Output Signal Group DC Specifications
40
Die Voltage Validation
41
AGTL+ FSB Specifications
41
AGTL+ Bus Voltage Definitions
42
FSB Differential BCLK Specifications
42
Electrical Test Circuit
43
TCK Clock Waveform
43
Differential Clock Waveform
44
Differential Clock Crosspoint Specification
44
3 Mechanical Specifications
45
Package Mechanical Drawings
45
Processor Package Assembly Sketch
45
Processor Package Drawing (Sheet 1 of 3)
46
Processor Package Drawing (Sheet 2 of 3)
47
Processor Package Drawing (Sheet 3 of 3)
48
Processor Component Keepout Zones
49
Package Loading Specifications
49
Package Handling Guidelines
50
Package Insertion Specifications
50
Processor Mass Specifications
50
Processor Materials
50
Processor Markings
51
Processor Land Coordinates
51
Processor Top-Side Markings (Example)
51
Processor Land Coordinates, Top View
52
Processor Land Coordinates, Bottom View
53
4 Land Listing
55
Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments
55
Land Listing by Land Name
55
Land Listing by Land Name
58
Land Listing by Land Number
67
Land Listing by Land Number
68
5 Signal Definitions
77
6 Thermal Specifications
85
Package Thermal Specifications
85
Quad-Core Intel® Xeon® Processor E5300 Series Thermal Specifications
87
Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile
88
Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile Table
88
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profiles
89
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Specifications
89
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile a Table
90
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B Table
90
Quad-Core Intel® Xeon® Processor X5365 Series Thermal Profile
91
Quad-Core Intel® Xeon® Processor X5365 Series Thermal Specifications
91
Quad-Core Intel® Xeon® Processor X5365 Series Thermal Profile (Sheet 1 of 2)
92
Quad-Core Intel® Xeon® Processor L5300 Series Thermal Specifications
92
Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile
93
Quad-Core Intel® Xeon® Processor L5318 Thermal Specifications
93
Quad-Core Intel® Xeon® Processor L5318 Thermal Profile
94
Thermal Metrology
95
Quad-Core Intel® Xeon® Processor L5318 Nominal Thermal Profile
95
Quad-Core Intel® Xeon® Processor L5318 Short Term Thermal Profile
95
Processor Thermal Features
96
Thermal Monitor Features
96
Thermal Monitor (TM1)
96
Thermal Monitor 2
97
On-Demand Mode
98
Thermal Monitor 2 Frequency and Voltage Ordering
98
PROCHOT# Signal
99
FORCEPR# Signal
99
THERMTRIP# Signal
100
Platform Environment Control Interface (PECI)
100
Introduction
100
PECI Topology
100
PECI Specifications
101
Conceptual Fan Control Diagram for a PECI-Based Platform
101
Gettemp0() and Gettemp1() Error Codes
102
7 Features
103
Power-On Configuration Options
103
Clock Control and Low Power States
103
Power-On Configuration Option Lands
103
Normal State
104
HALT or Extended HALT State
104
Processor X5365 Series
105
Extended HALT Maximum Power
105
Stop-Grant State
106
Stop Clock State Machine
106
Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State
107
Enhanced Intel Speedstep® Technology
107
8 Boxed Processor Specifications
109
Introduction
109
Boxed Quad-Core Intel® Xeon® Processor 5300 Series 1U Passive/3U+ Active Combination Heat Sink (with Removable Fan)
109
Boxed Quad-Core Intel® Xeon® Processor 5300 Series 2U Passive Heat Sink
110
Passive Quad-Core Intel® Xeon® Processor 5300 Series Processor Thermal Solution (Exploded View)
110
Mechanical Specifications
111
Boxed Processor Heat Sink Dimensions (CEK)
111
Top Side Board Keepout Zones (Part 1)
112
Top Side Board Keepout Zones (Part 2)
113
Bottom Side Board Keepout Zones
114
Board Mounting-Hole Keepout Zones
115
Volumetric Height Keep-Ins
116
Pin Fan Cable Connector (for Active CEK Heat Sink)
117
Pin Base Board Fan Header (for Active CEK Heat Sink)
118
Boxed Processor Heat Sink Weight
119
Boxed Processor Retention Mechanism and Heat Sink Support (CEK)
119
Electrical Requirements
119
Fan Power Supply (Active CEK)
119
Boxed Processor Cooling Requirements
120
Fan Cable Connector Pin out for 4-Pin Active CEK Thermal Solution
120
PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution
120
Fan Specifications for 4-Pin Active CEK Thermal Solution
120
Boxed Processor Contents
121
9 Debug Tools Specifications
123
Debug Port System Requirements
123
Target System Implementation
123
System Implementation
123
Logic Analyzer Interface (LAI)
123
Mechanical Considerations
124
Electrical Considerations
124
Advertisement
Intel Quad-Core Xeon 5300 Series Datasheet (112 pages)
Quad-Core Processor
Brand:
Intel
| Category:
Computer Hardware
| Size: 4 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
9
Quad-Core Intel® Xeon® Processor 5300 Series Features
10
Terminology
11
State of Data
13
References
13
2 Electrical Specifications
15
Front Side Bus and GTLREF
15
Power and Ground Lands
16
Decoupling Guidelines
16
VCC Decoupling
16
VTT Decoupling
16
Front Side Bus AGTL+ Decoupling
17
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
17
Front Side Bus Frequency Select Signals (BSEL[2:0])
18
Core Frequency to FSB Multiplier Configuration
18
BSEL[2:0] Frequency Table
18
PLL Power Supply
19
Voltage Identification (VID)
19
Voltage Identification Definition
20
Reserved, Unused, or Test Signals
21
Loadline Selection Truth Table for LL_ID[1:0]
21
Market Segment Selection Truth Table for MS_ID[1:0]
21
Front Side Bus Signal Groups
22
FSB Signal Groups
22
AGTL+ Signal Description Table
23
Non AGTL+ Signal Description Table
23
CMOS Asynchronous and Open Drain Asynchronous Signals
24
Test Access Port (TAP) Connection
24
Platform Environmental Control Interface (PECI) DC Specifications
24
DC Characteristics
24
Signal Reference Voltages
24
Input Device Hysteresis
25
PECI DC Electrical Limits
25
Mixing Processors
26
Absolute Maximum and Minimum Ratings
26
Processor Absolute Maximum Ratings
26
Processor DC Specifications
27
Flexible Motherboard Guidelines (FMB)
27
Voltage and Current Specifications
27
Quad-Core Intel® Xeon® Processor E5300 Series Load Current Versus Time
29
Quad-Core Intel® Xeon® Processor X5300 Series Load Current Versus Time
30
Transient Tolerance Load Lines
31
Transient Tolerance Load Lines
32
AGTL+ Signal Group Specifications
32
VCC Overshoot Specification
33
CMOS Signal Input/Output Group and TAP Signal Group DC Specifications
33
Open Drain Output Signal Group DC Specifications
33
Die Voltage Validation
34
AGTL+ FSB Specifications
34
VCC Overshoot Example Waveform
34
AGTL+ Bus Voltage Definitions
35
FSB Differential BCLK Specifications
35
Electrical Test Circuit
36
Differential Clock Waveform
36
Differential Clock Crosspoint Specification
37
3 Mechanical Specifications
39
Package Mechanical Drawings
39
Processor Package Assembly Sketch
39
Processor Package Drawing (Sheet 1 of 3)
40
Processor Package Drawing (Sheet 2 of 3)
41
Processor Package Drawing (Sheet 3 of 3)
42
Processor Component Keepout Zones
43
Package Loading Specifications
43
Package Handling Guidelines
44
Package Insertion Specifications
44
Processor Mass Specifications
44
Processor Materials
44
Processor Markings
45
Processor Land Coordinates
45
Processor Top-Side Markings (Example)
45
Processor Land Coordinates, Top View
46
Processor Land Coordinates, Bottom View
47
4 Land Listing
49
Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments
49
Land Listing by Land Name
49
Land Listing by Land Number
60
5 Signal Definitions
71
6 Thermal Specifications
79
Package Thermal Specifications
79
Quad-Core Intel® Xeon® Processor E5300 Series Thermal Specifications
80
Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile
81
Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile Table
81
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profiles
82
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Specifications
82
Thermal Metrology
83
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile a Table
83
Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile B Table
83
Processor Thermal Features
84
Thermal Monitor Features
84
Thermal Monitor (TM1)
84
Thermal Monitor 2
85
On-Demand Mode
86
Thermal Monitor 2 Frequency and Voltage Ordering
86
PROCHOT# Signal
87
FORCEPR# Signal
87
THERMTRIP# Signal
88
Platform Environment Control Interface (PECI)
88
Introduction
88
PECI Topology
88
PECI Specifications
89
Conceptual Fan Control Diagram for a PECI-Based Platform
89
Gettemp0() and Gettemp1() Error Codes
90
7 Features
91
Power-On Configuration Options
91
Clock Control and Low Power States
91
Power-On Configuration Option Lands
91
Normal State
92
HALT or Extended HALT State
92
Stop Clock State Machine
93
Extended HALT Maximum Power
93
Stop-Grant State
94
Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State
94
Enhanced Intel Speedstep® Technology
95
8 Boxed Processor Specifications
97
Introduction
97
Boxed Quad-Core Intel® Xeon® Processor 5300 Series 1U Passive/3U+ Active Combination Heat Sink (with Removable Fan)
97
Boxed Quad-Core Intel® Xeon® Processor 5300 Series 2U Passive Heat Sink
98
Passive Quad-Core Intel® Xeon® Processor 5300 Series Processor Thermal Solution (Exploded View)
98
Mechanical Specifications
99
Boxed Processor Heat Sink Dimensions (CEK)
99
Top Side Board Keepout Zones (Part 1)
100
Top Side Board Keepout Zones (Part 2)
101
Bottom Side Board Keepout Zones
102
Board Mounting-Hole Keepout Zones
103
Volumetric Height Keep-Ins
104
Pin Fan Cable Connector (for Active CEK Heat Sink)
105
Pin Base Board Fan Header (for Active CEK Heat Sink)
106
Boxed Processor Heat Sink Weight
107
Boxed Processor Retention Mechanism and Heat Sink Support (CEK)
107
Electrical Requirements
107
Fan Power Supply (Active CEK)
107
Boxed Processor Cooling Requirements
108
Fan Cable Connector Pin out for 4-Pin Active CEK Thermal Solution
108
PWM Fan Frequency Specifications for 4-Pin Active CEK Thermal Solution
108
Fan Specifications for 4-Pin Active CEK Thermal Solution
108
Boxed Processor Contents
109
9 Debug Tools Specifications
111
Debug Port System Requirements
111
Target System Implementation
111
System Implementation
111
Logic Analyzer Interface (LAI)
111
Mechanical Considerations
112
Electrical Considerations
112
Intel Quad-Core Xeon 5300 Series Design Manual (100 pages)
Thermal/Mechanical Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 4 MB
Table of Contents
Table of Contents
3
Revision History
7
1 Introduction
9
Objective
9
Scope
9
References
9
Reference Documents
9
Definition of Terms
10
Terms and Descriptions
10
2 Thermal/Mechanical Reference Design
13
Mechanical Requirements
13
Processor Mechanical Parameters
13
Processor Mechanical Parameters Table
13
Quad-Core Intel® Xeon® Processor 5300 Series Package
14
Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (1 of 3)
15
Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (2 of 3)
16
Quad-Core Intel® Xeon® Processor 5300 Series Mechanical Drawing (3 of 3)
17
Quad-Core Intel® Xeon® Processor 5300 Series Considerations
18
Processor Thermal Parameters and Features
18
Thermal Control Circuit and TDP
18
Processor Case Temperature Measurement Location
19
Digital Thermal Sensor
20
Platform Environmental Control Interface (PECI)
20
Multiple Core Special Considerations
21
DTS Domain for Quad-Core Intel® Xeon® Processor 5300 Series
21
Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5300 Series Thermal Management Features
22
Processor Core Geometric Center Locations
23
Processor Core Geometric Center Dimensions
23
Thermal Profile
24
Thermal Profile Diagram
24
TCONTROL Definition
25
TCONTROL Value and Digital Thermal Sensor Value Interaction
25
Thermal Profile Concepts for the Quad-Core Intel® Xeon® Processor 5300 Series
26
TCONTROL and Thermal Profile Interaction
26
Dual Thermal Profile Diagram
27
Performance Targets
28
Thermal Profiles a and B for the Quad-Core Intel® Xeon® Processor X5300
29
Series
29
Thermal Profile for Quad-Core Intel® Xeon® Processor E5300 Series
30
Thermal Profile for Quad-Core Intel® Xeon® Processor L5300 Series
31
Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor X5300 Series
32
Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor E5300 Series
32
Characterizing Cooling Solution Performance Requirements
33
Fan Speed Control
33
Intel Reference Heatsink Performance Targets for Quad-Core Intel® Xeon® Processor L5300 Series
33
TCONTROL and Fan Speed Control
34
Processor Thermal Characterization Parameter Relationships
35
Processor Thermal Characterization Parameter Relationships
36
Chassis Thermal Design Considerations
37
Thermal/Mechanical Reference Design Considerations
37
Heatsink Solutions
37
Thermal Interface Material
38
Summary
39
Assembly Overview of the Intel Reference Thermal Mechanical Design
40
Exploded View of CEK Thermal Solution Components
40
Thermal Solution Performance Characteristics
42
CEK Heatsink Thermal Performance
42
Thermal Profile Adherence
43
CEK Heatsink Thermal Performance
43
CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5300 Series Thermal Profile a
44
CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile B
45
CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile
46
Components Overview
47
CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor L5300 Series Thermal Profile
47
Isometric View of the 2U+ CEK Heatsink
48
Isometric View of the 1U CEK Heatsink
48
CEK Heatsink Thermal Mechanical Characteristics
49
Recommended Thermal Grease Dispense Weight
49
CEK Spring Isometric View
50
Isometric View of CEK Spring Attachment to the Base Board
50
Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5300 Series
51
Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only)
51
Fan Cable Connection (Active CEK)
52
Fan Specifications (Boxed 4-Wire PWM/DTS Heatsink Solution)
52
Fan Cable Connector Pin out (Active CEK)
53
A 1U Alternative Heatsink Thermal/Mechanical Design
55
Component Overview
55
Isometric View of the 1U Alternative Heatsink
55
A.1 Component Overview
55
A-1 Isometric View of the 1U Alternative Heatsink
55
Thermal Solution Performance Characteristics
56
Alternative Heatsink Thermal Performance
56
1U Alternative Heatsink Thermal Mechanical Characteristics
56
Thermal Profile Adherence
57
Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon® Processor E5300 Series Thermal Profile
57
Processor L5300 Series Thermal Profile
58
Mechanical Drawings
59
CEK Heatsink (Sheet 1 of 4)
59
CEK Heatsink (Sheet 2 of 4)
59
CEK Heatsink (Sheet 3 of 4)
59
CEK Heatsink (Sheet 4 of 4)
59
CEK Spring (Sheet 1 of 3)
59
CEK Spring (Sheet 2 of 3)
59
CEK Spring (Sheet 3 of 3)
59
Alternative Heatsink (1 of 4)
59
Alternative Heatsink (2 of 4)
59
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 1 of 6)
67
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 2 of 6)
68
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 3 of 6)
69
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 4 of 6)
70
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 5 of 6)
71
Baseboard Keepout Footprint Definition and Height Restrictions for Enabling Components (Sheet 6 of 6)
72
Active CEK Thermal Solution Volumetric (Sheet 1 of 3)
77
Active CEK Thermal Solution Volumetric (Sheet 2 of 3)
78
Active CEK Thermal Solution Volumetric (Sheet 3 of 3)
79
B-24 1U Alternative Heatsink (4 of 4)
83
C Heatsink Clip Load Methodology
85
Overview
85
Test Preparation
85
Heatsink Preparation
85
C.1 Overview
85
C.2 Test Preparation
85
Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
86
Load Cell Installation in Machined Heatsink Base Pocket - Side View
87
Preload Test Configuration
87
Typical Test Equipment
88
Test Procedure Examples
88
Time-Zero, Room Temperature Preload Measurement
88
Preload Degradation under Bake Conditions
89
D Safety Requirements
91
E Quality and Reliability Requirements
93
Intel Verification Criteria for the Reference Designs
93
Reference Heatsink Thermal Verification
93
Environmental Reliability Testing
93
Use Conditions Environment
94
Material and Recycling Requirements
95
F Enabled Suppliers Information
97
Supplier Information
97
F.1 Supplier Information
97
Intel Enabled Suppliers
97
Intel Reference Solution
97
Additional Suppliers
98
Intel Reference Solution
99
Advertisement
Advertisement
Related Products
Intel Xeon 5600 Series
Intel Xeon 5500 Series
Intel Xeon 5400 Series
Intel Dual-Core Xeon 5100 Series
Intel Xeon
Intel Xeon LV
Intel Xeon 7300 Series
Intel Xeon 3400 Series
Intel Xeon 7500 Series
Intel Xeon Phi
Intel Categories
Motherboard
Computer Hardware
Server
Desktop
Server Board
More Intel Manuals
Login
Sign In
OR
Sign in with Facebook
Sign in with Google
Upload manual
Upload from disk
Upload from URL