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Thermal Specifications
Table 6-6.
Quad-Core Intel® Xeon® Processor X5365 Series Thermal Specifications
Core
Frequency
Launch to FMB
Notes:
1.
These values are specified at V
the processor is not to be subjected to any static V
specified I
2.
Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
4.
These specifications are based on silicon characterization.
5.
Power specifications are defined at all VIDs found in
L5300 Series may be shipped under multiple VIDs for each frequency.
6.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
7.
8.
Figure 6-3.
Quad-Core Intel® Xeon® Processor X5365 Series Thermal Profile
65
65
60
60
55
55
50
50
45
45
40
40
35
35
Notes:
1.
Please refer to
2.
Refer to the Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines for
system and environmental implementation details.
3.
4.
5.
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Maximum
Thermal
Power
Design Power
(W)
180
CC_MAX
. Please refer to the loadline specifications in
CC
.
CASE
0
0
10
10
20
20
30
30
40
40
50
50
Table 6-7
for discrete points that constitute the thermal profile.
Minimum
T
CASE
(W)
(°C)
150
5
for all processor frequencies. Systems must be designed to ensure
and I
combination wherein V
CC
CC
Section
2.
Table
2-3. The Quad-Core Intel® Xeon® Processor
Thermal Profile
Thermal Profile
Y = 0.187*x + 35.0
Y = 0.187*x + 35.0
60
60
70
70
80
80
90
90
100
100
Pow e r [W]
Pow e r [W]
Maximum
T
Notes
CASE
(°C)
See
Figure
6-3;
1, 2, 3, 4, 5, 6
Table 6-7
exceeds V
CC
CC_MAX
.
CASE
110
110
120
120
130
130
140
140
150
150
at
93
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