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Boxed Processor Specifications
8.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor.
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
The physical space requirements and dimensions for the boxed processor and
assembled heat sink are shown in
Figure 8-10
connector used for the active CEK fan heat sink solution.
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Figure 8-4
are the mechanical drawings for the 4-pin board fan header and 4-pin
through
Figure
8-8.
Figure 8-9
through
113
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