Mgc Components Description - Polycom MGC-100 Getting Started Manual

Chapter 2 - Hardware Description

MGC Components Description

2-8
The following table describes the MGC components. A more detailed
description is found in the MGC-50/MGC-100, Hardware & Installation
Manual, Version 7.5.
Table 2-1: MGC Component Description
MGC
Component
Control Module
Backplane
Power Plane
Description
The Main Control Module performs the conference setup
and termination and resource allocation in both the
MGC-100 and the MGC-50. The Main Control Module has
an Intel-based Pentium processor, a hard disk drive and
256 MB of RAM. To enable 2000 reservations, the MCU
Main Control Module must contain at least 128 MB of
RAM.
The backplane is an electronic circuit board into which
The Network Interface Module, the Main Control Module,
Functional Modules, and I/O cards are plugged so the
various modules can communicate with each other. The
Backplane is based on the "universal slot" concept, where
any card can be inserted in any slot.
In the MGC-100, the front of the Backplane contains 16
slots for Functional Modules and an additional slot (Slot
A) for the Main Control Module. The back of the
Backplane contains 17 slots for I/O cards (16 slots for I/O
and one "dummy" slot). In the MGC-50, the front of the
Backplane contains eight slots for Functional Modules
and an additional slot (Slot A) for the Main Control
Module. The back of the Backplane also contains eight
slots for I/O cards and one "dummy" slot. The Power
Supply Module provides power to the Backplane via a
power bus.
The Power Plane is a conducting layer providing power to
the components. It is part of the Backplane and is
designed to accommodate hot swapping of power
supplies. In the MGC-100, up to three Power Supply
Modules can be plugged into the Power Plane. In the
MGC-50, instead of a Power Plane, there is one power
supply that is connected to the Backplane by wire leads.