Sony CXD2701Q Data Book page 24

Reliability Test Standards
Types
of test Condition
Supply
voltages
Testing time
LTPD
High temperature
operation
Ta
=
125'C, 150"C Typical lOOOh
5%
High temperature
with
bias
Ta
=
125C,
150'C
Typical
lOOOh
5%
High temperature
Storage
Ta
=
150'C
lOOOh
5%
Low
temperature
storage
Ta
=
-65*C
lOOOh
5%
High temperature and
high humidity storage
Ta
=
85*C
85% RH
lOOOh
5%
High temperature and
high humidity
with bias
Ta=85'C 85% RH
Typical
lOOOh
5%
Pressure
cooker
Ta
=
121°C
100%RH
203k Fa
96h
5%
Temperature
cycle Ta
= -S5C
to
+
150'C 100c
10%
Heat shock
Ta
= -6SC
to
+
150'C
100c
10%
Soldering heat resistance
T
solder=260'C
10s
10%
Solderability T
solder=230"C
(rosin
type
flux) 5s
10%
Mechanical shock
X,
Y.
Z
lS,O00m/s'
Haif part of sinusoidal wave
of
0.5ms
3times
for
each
direction
10%
Vibration
X, Y,
G
200m/s-
10Hz
to
2000Hz
to
10Hz
(4min)
Sinusoidal
wave
vibration
16minutes
for
each
direction
10%
Constant
acceleration
X,
Y,
2
200,
000m/
s
1
Centrifugal acceleration
lminute
for
each
direction
10%
Free
fall
Free
fall
from
the height of
75cm
to
maple
plate
3times 10%
Lead
strength
(bend)
CPU")
based on
JIS 10%
Electrostatic strength
Device
must
be designed again,
when
electrostatic
strength below Standard supplying
surge
voltage
to
each
pin
under
the condition
of
C
=
200pF
and
Rs
=
0fi.
LTPD:
Lot
Tolerance Percent Defective
-20-