Sony CXD2701Q Data Book page 20

(2)
Resistance
to
soldering heat
when
mounting
infrared reflow.
When
surface
mount
devices (SOP,
QFP
etc)
are dipped
directly into a solder pot,
the device moisture
resistance
may
deteri-
orate
and
thermal
stress
generate cracks
in
the
pallet.
Carefully
observe
the
mounting
conditions,
Recommended
temperature
profile
when
mounting
infrared
reflows
is
shown
in
the
figure below.
1
20*C
^,
235'CnTa* 10
see.
3
to
4-C/set
/
\
50
to
300
set
'
preheated
part
reflow part -» time
-
16