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(3)
Memory
nomenclature
[Example]
CX
K
5.4 6
4
A
P-
OOPO
—
Standby
current
Access time
Package mark
P
:
Dual
in-line
package
D
:
Ceramic
Dual
In-line
Package
SP
:
Skinny type
dual
inline
package
M
:
Small
outline
package
J
:
Small
outline
J-leaded
package
Quad
Fiat
J-Leaded
package
TM
:
Thin smalt
outline
package
(Normal)
YM
:
Thin small
outline
package
(Reverse)
(Mirror
image
pin
out)
—
Improvement mark
Improvement mark
is
affixed
when
specifications
are
partially
improved.
—
Product
number
Identifies
the
individual
product.
Product category
mark
K:
Memory
—
Sony
IC
mark
I
(4)
Microcomputer nomenclature
[Example]
CX
P
5
06
8
-QQOP
Package mark
(P, Q,
S)
OEM
code
Product
number
Indentifies
the
individual
product.
Product category
mark
P
:
Microcomputer
Sony
IC
mark
(5)
Hybrid
IC
nomenclature
[Example]
S
BX
0000-00
~~
PL.
-
Classification
Product's
number
Identifies
individual product,
Sony
hybrid IC
mark
-9-
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