Sony CXD2701Q Data Book page 23

Quality
assurance
criteria
and
reliability
test criteria
1)
Quality
assurance
in
shipping
Establishing quality
in
the
design and
in
fabrication
is
essential to
keep
the quality
and
reliability
levels
of the
semiconductor
devices
at
a high
level.
This
is
done
by the
"Zero-defect"
(ZD)
movement.
Further
sam-
pling
checks,
in
units of
shipping
lot,
is
done
on
products that
have been
"totally-
inspected"
at
the
final
fabrication stage,
thus
ensuring no detective items.
This
sampling
inspection
is
done
in
accordance with MIL-
STD-105D.
2)
Reliability
The
reliability
test
is
done, periodically, to
confirm
reliability level.
Periodic
Reliability
Test
Item
Testing time
LTPD
Electrical
Characteristics
Test
In
order to
know
the
initial
quality
level
some types are selected
and
tested again.
Life
Test
high
temperature
operation
high temperature
and high
humidity with bias
pressure
cooker
up to
LOOOh
up
to
1000 h
up
to
200
h
10%
10%
10%
Environmental Test
soldering heat resistance
heat cycle
10s
100
cycles
15%
15%
Mechanical Test solderability
length strength
Japan
Industrial
Standard (JIS)
15%
15%
Other Tests
If
necessary, tests
are selected
according to
JIS
C7021 C7022
and EIAJ
S0121 IC121.
I
"These
tests
are selected by
sampling standard.
LTPD:
Lot
Tolerance Percent Defective
These
tests
and
inspection
data are useful not
only
to
improve design and wafer processes, but
also serve
to
forecast
reliability
at the
consumer
level.
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