Sony CXD2701Q Data Book page 18

Semiconductor ic, digital audio ics
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(3)
Handling
of
delivery
box
The
delivery
box used
for
carrying
sub-
strates
must
be
made
of
conductive
plastic.
Do
not
use a
vinyl
chloride or acrylic delivery
box,
otherwise
static
electricity
will
be gener-
ated.
handling
of
delivery
box
conductive
plastic
Soldering operation
(1)
Soldering
iron
Use
a
soldering
iron
with a
grounding
wire
and
an
insulation
resistance greater
than
10MQ
(DC 500V)
after
five
minutes
from
energizing.
example
of
solder iron
tip
grounding
voltage adjuster
output voltage
6
to
24V
4
77T
77T
grounding
plate
(4)
Treatment
after vehicle
transport
After truck transport, place the
magazine,
package box
or
delivery
box on
the
grounded
rack,
work
table for discharging.
(5)
Handling
of
mounted
substrates
Wear
cotton gloves
when
handling.
As
far
as
possible,
avoid touching soldered
faces.
When
handling
mounted
substrates
individu-
ally,
be
sure
to
use
a
conductive
bag.
Do
not
use
a
polyethylene bag.
handling
of
mounted
substrate
^cotton glove
conductive
bag
(2)
Operation
After inserting the
semiconductor
device
into
the
substrate, solder
it
as
quickly
as
possible.
Do
not carry the
substrate with the
inserted
semiconductor
device by
car.
(3) Correction
When
correcting
parts
(semiconductor
device
and
CR
parts) after solder-dipping,
be
sure
to
wear
cotton
gloves.
(4)
Manual
soldering
Solder with
wrist
strap connected
to
the
hand.
(5)
Removing
semiconductor
device
Do
not use the Solder-Pult
when
removing
the
semiconductor
device.
Use
a
Solder-wick
or equivalent.
solder
remover
soider-wick
so.er
pult
- 14-

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