Fill Groove With Adhesive - Intel 3210 Thermal/Mechanical Design Manual

Thermal Metrology
Figure 5-23. Fill Groove with Adhesive
30. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive
and let it set for a couple of minutes.
31. Using a blade carefully shave any Loctite* left above the IHS surface; take into
consideration instructions from step 27.
Note: The adhesive shaving process should be performed when the glue is partially cured but
still soft (about 1 hour after applying). This will keep the adhesive surface flat and
smooth with no pits or voids. If you have void areas in the groove, refill them and
shave the surface a second time.
32. Clean the IHS surface with Alcohol and keep the Thermocouple wire properly
managed to avoid insulation damage kinks and tangling.
33. Once again, measure resistance from the Thermocouple connector (hold both wires
to a DMM probe) to the IHS surface, this should display the same value as read
during Thermocouple conditioning Section xxx. This step insures the bead is still
making good contact to the IHS after attachment is complete.
34. Wind the thermocouple wire into loops and now it's ready to be used for thermal
testing use. Refer to
Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide
Figure 5-24.
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