Surface-Mount Design - Analog Devices ADSP-21367 Manual

ADSP-21367/ADSP-21368/ADSP-21369
COMPLIES WITH JEDEC STANDARD MO-192-BAL-2.

SURFACE-MOUNT DESIGN

Table 48 is provided as an aide to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 48. BGA_ED Data for Use with Surface-Mount Design
Package
256-Lead Ball Grid Array BGA_ED
(BP-256)
A1 BALL
INDICATOR
27.00
TOP VIEW
BSC SQ
DETAIL A
1.27
NOM
0.70
0.60
0.50
0.20
COPLANARITY
Figure 50. 256-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
Dimension shown in millimeters
Ball Attach Type
Solder Mask Defined (SMD)
Rev. D | Page 54 of 56 | November 2008
20 18 16 14 12 10
19 17 15 13 11
BOTTOM
VIEW
24.13
REF SQ
1.00
0.80
DETAIL A
0.60
0.90
BALL
0.75
DIAMETER
0.60
(BP-256)
Solder Mask Opening
0.63 mm
A1 CORNER
INDEX AREA
8 6 4 2
9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1.70 MAX
0.10
MIN
SEATING
PLANE
0.25 MIN 4
Ball Pad Size
0.73 mm