Package Dimensions - Analog Devices ADSP-21367 Manual

PACKAGE DIMENSIONS

The ADSP-21367/ADSP-21368/ADSP-21369 processors are
available in 256-ball RoHS compliant and leaded BGA_ED, and
208-lead RoHS compliant LQFP_EP packages.
0.75
0.60
0.45
1.00 REF
SEATING
PLANE
1.45
0.20
1.40
0.15
1.35
0.09
0.15
7°
0.10
3.5°
0.05
0.08
0°
COPLANARITY
VIEW A
ROTATED 90° CCW
30.20
30.00 SQ
29.80
1.60 MAX
208
1
PIN 1
TOP VIEW
(PINS DOWN)
52
53
VIEW A
COMPLIANT TO JEDEC STANDARDS MS-026-BJB-HD
NOTE:
THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND THERMALLY CONNECTED TO VSS.
THIS SHOULD BE IMPLEMENTED BY SOLDERING THE EXPOSED PAD TO A VSS PCB LAND THAT IS THE SAME SIZE
AS THE EXPOSED PAD. THE VSS PCB LAND SHOULD BE ROBUSTLY CONNECTED TO THE VSS PLANE IN THE PCB
WITH AN ARRAY OF THERMAL VIAS FOR BEST PERFORMANCE.
Figure 49. 208-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
Dimensions shown in millimeters
Rev. D | Page 53 of 56 | November 2008
ADSP-21367/ADSP-21368/ADSP-21369
28.10
28.00 SQ
27.90
157 157
156
156
105 105
104 104
(SW-208-1)
25.50
REF
8.712
REF
EXPOSED
PAD
BOTTOM VIEW
(PINS UP)
0.27
0.50
0.22
BSC
0.17
LEAD PITCH
208
1
8.890
REF
52
53