NEC 78K0S/KA1+ User Manual page 373

Table 25-1. Surface Mounting Type Soldering Conditions (2/2)
20-pin plastic SSOP (lead-free products)
µ
PD78F9221MC(T)-5A4-A, 78F9222MC(T)-5A4-A, 78F9221MC(T2)-5A4-A
µ
PD78F9221MC(S)-5A4-A, 78F9222MC(S)-5A4-A, 78F9221MC(R)-5A4-A, 78F9222MC(R)-5A4-A,
µ
PD78F9221MC(A)-5A4-A
µ
PD78F9222MC(A2)-5A4-A
Soldering Method
Infrared reflow Package peak temperature: 260°C, Time: 30 seconds max. (at 210°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 hours)
Wave soldering For details, contact an NEC Electronics sales representative.
Partial heating Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Notes 1. Under development
2. After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
Note 1
, 78F9222MC(A)-5A4-A
Note 1
Soldering Conditions
User's Manual U16898EJ3V0UD
Note 1
, 78F9222MC(T2)-5A4-A
Note 1
, 78F9221MC(A2)-5A4-A
Note 2
(after that, prebake at 125°C for
Note 1
,
Note 1
,
Recommended
Condition Symbol
IR60-207-3
−
−
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