ADLINK Technology CoreModule 720 Reference Manual page 8

Chapter 1
Chip Specifications
The following integrated circuits (ICs) are used in the CoreModule 720 single board computer:
•
Intel® Corporation and the Atom™ E6XXT processors
Data sheet: http://download.intel.com/embedded/processor/datasheet/324208.pdf
•
Hynix Semiconductor, Inc. and the H5PS2G83AFR-S6C DDR2 on-board System Memory
Web site: http://www.hynix.com/gl/products/computing/computing_info.jsp
•
Intel Corporation and the PCH EG20T chip, used for the I/O Hub (Southbridge)
Data sheet: http://download.intel.com/embedded/chipsets/datasheet/324211.pdf
•
Texas Instruments and the SN65HVD1040D CAN Transceiver
Web site: http://focus.ti.com/lit/ds/symlink/sn65hvd1040.pdf
•
Intel Corporation and the 82574IT chip used for the Gigabit Ethernet controller
Data sheet: http://download.intel.com/design/network/datashts/82574.pdf
•
Atmel Corporation and the AT25128B-SSHL-B Ethernet EEPROM
Data sheet: http://www.atmel.com/dyn/resources/prod_documents/doc8535.pdf
•
Fintek and the F85226FG, LPC-to-ISA Bridge
Data sheet:
http://pdf1.alldatasheet.com/datasheet-pdf/view/257962/FINTEK/F85226FG.html
•
PLX Technology and the PEX8112 PCIe-to-PCI Bridge
Data sheet:
http://www.plxtech.com/products/expresslane/pex8112#technicaldocumentation
•
Atmel Corporation and the AT25640B-SSHL SPI EEPROM
Data sheet: http://www.atmel.com/dyn/resources/prod_documents/doc8535.pdf
•
Maxim Integrated Products and the MAX3245EEUI+ RS-232 Serial Port Transceiver
Web site: http://www.maxim-ic.com/datasheet/index.mvp/id/1847
•
Analog Devices and the ADM1032ARMZ Temperature Monitor
Data sheet: http://www.onsemi.com/pub_link/Collateral/ADM1032-D.PDF
•
Greenliant and the GLS85LS1008A Solid State NANdrive
Data sheet: http://www.greenliant.com/dotAsset/45628.pdf
NOTE If you are unable to locate the datasheets using the links provided, search the internet
using the name of the manufacturer or component model and locate the documents
you need.
2 Reference Manual
About This Manual
CoreModule 720