ADLINK Technology CoreModule 730 Reference Manual

Stackable single board computer
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CoreModule
730
TM
(Stackable Single Board Computer)

Reference Manual

P/N 50-1Z019-1000

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Summary of Contents for ADLINK Technology CoreModule 730

  • Page 1: Reference Manual

    CoreModule (Stackable Single Board Computer) Reference Manual P/N 50-1Z019-1000...
  • Page 2 Notice Page DISCLAIMER ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damages.
  • Page 3: Table Of Contents

    Power Button ..........................23 Reset Switch..........................23 BIOS Recovery (Using Reset Switch) .................23 Speaker ............................23 Miscellaneous ..........................23 Battery ............................23 Real Time Clock (RTC)......................23 User GPIO Interface .........................24 System Management Bus (SMBus)..................24 Ethernet External LED ......................25 Watchdog Timer ........................25 Power Interface..........................25 CoreModule 730 Reference Manual...
  • Page 4 Logo Image Requirements....................... 27 Appendix A Technical Support ....................29 Index ..............................31 List of Figures Figure 2-1. Stacking Modules with the CoreModule 730 ............3 Figure 2-2. Block Diagram ......................6 Figure 2-3. Component Locations (Front View) ................. 8 Figure 2-4.
  • Page 5: Chapter 1 About This Manual

    • PCI 2.2 Specification Revision 2.2, December 18, 1998 Web site: http://www.pcisig.com Major Integrated Circuit (IC) Specifications The following chip specifications are used in the CoreModule 730 processor module: • Intel Corporation and the Atom processor chip Web site: http://download.intel.com/design/processor/datashts/319535.pdf •...
  • Page 6 Intel Corporation and the 82574IT Gigabit Ethernet controller Web site: http://download.intel.com/design/network/datashts/82574.pdf NOTE If you are unable to locate the datasheets using the links provided, search the internet to find the manufacturer’s web site and locate the documents you need. Reference Manual CoreModule 730...
  • Page 7: Chapter 2 Product Overview

    • Analog or digital I/O interfaces Stackable expansion modules can be stacked with the CoreModule 730 avoiding the need for card cages and backplanes. The stackable expansion modules can be mounted directly to the SUMIT connector of the CoreModule 730. SUMIT-compliant modules can be stacked with an inter-board spacing of ~0.60" (15mm) so that a 3-module system fits in a 3.6"...
  • Page 8: Product Description

    Product Overview Product Description The CoreModule 730 SBC is an exceptionally high integration, x86-based, PC compatible system in the ISM (Industry Standard Module) form factor. This rugged and high quality single-board system contains all the component subsystems of a PC/AT motherboard plus the equivalent of several PC/AT expansion boards.
  • Page 9 Single channel 24-bit LVDS ♦ • Miscellaneous Provides Real Time Clock and CMOS RAM, with support for battery-free operation ♦ Provides General Purpose I/O (GPIO) interface ♦ Supports customizable Splash Screen ♦ Supports Watchdog Timer (WDT) ♦ CoreModule 730 Reference Manual...
  • Page 10: Block Diagram

    Chapter 2 Product Overview Block Diagram Figure 2-2 shows the functional components of the CoreModule 730. Intel Atom CK540 Temperature Z530 Clock Sensor LVDS Header SDVO to RGB DDR2 Header Controller SODIMM (up to 2GB) Intel USB0 and USB1 US15W...
  • Page 11: Major Components (Ics)

    Product Overview Major Components (ICs) Table 2-1 lists the major ICs, including a brief description of each, on the CoreModule 730, and Figures 2-3 show the locations of the major ICs on the board. Table 2-1. Major Components (ICs) Descriptions and Functions Chip Type Mfg.
  • Page 12: Figure 2-3. Component Locations (Front View)

    Chapter 2 Product Overview Figure 2-3. Component Locations (Front View) Reference Manual CoreModule 730...
  • Page 13: Header, Connector, And Socket Definitions

    20-pin, 0.079" (2mm), right-angle header for Video Out J9 – IDE Front 44-pin, standard header for primary IDE interface J10 – Compact Flash Back 50-pin, 0.050" (1.27mm) socket for Type I or II Compact Flash (on back of the board; cards Figure 2-4) CoreModule 730 Reference Manual...
  • Page 14: Figure 2-5. Connector Pin Identifications

    11 is directly across from pin 1, is noted in this way: 20-pin, 2 rows, consecutive (1, 11). The second number in the parenthesis is always directly across from pin 1. See Figure 2-5. 20-pin, two rows, 20-pin, two rows, Odd/Even, (1, 2) Consecutive, (1, 11) Figure 2-5. Connector Pin Identifications Reference Manual CoreModule 730...
  • Page 15: Jumper Header Definitions

    +3.3 Volts (Pins 2-3) Default Voltage Select JP8 – N/A For manufacturing only For manufacturing only JP9 – Clear CMOS Normal (pins 1-2) Default Clear CMOS Setup (pins 2-3) Note: All jumper headers use 0.079" (2mm) pin spacing. CoreModule 730 Reference Manual...
  • Page 16: Specifications

    Component height should not exceed 0.435" (11.05mm) from the upper surface of the board and 0.100" (2.54mm) from the lower surface of the board. Mechanical Specifications 0.200 0.000 0.185 3.375 3.575 Figure 2-7. Mechanical Dimensions (Front View) Reference Manual CoreModule 730...
  • Page 17: Power Specifications

    Non-operating 5% to 95% relative humidity, non-condensing Thermal/Cooling Requirements The CPU is the primary source of heat on the board. The CoreModule 730 CPU is designed to operate at maximum speed and requires a heatsink (provided). CoreModule 730 Reference Manual...
  • Page 18 Chapter 2 Product Overview Reference Manual CoreModule 730...
  • Page 19: Chapter 3 Hardware

    NOTE ADLINK Technology, Inc. only supports the features and options listed in this manual. The main components used on the CoreModule 730 may provide more features or options than are listed in this manual. Some of these features/options are not supported on the module and will not function as specified in the chip documentation.
  • Page 20: Cpu

    DDR2 memory interface (shared with the system controller) supporting a bandwith of up to 2 GB (DDR2 @ up to 533 MHz.) Memory The CoreModule 730 provides one 200-pin DDR2 SODIMM of up to 2GB of SDRAM memory, which is shared between the system memory controller and the graphics memory controller in the SCH. Interrupt Channel Assignments...
  • Page 21: Memory Map

    000D0000h 000DFFFFh Reserved for Extended BIOS 000E0000h 000EFFFFh Extended System BIOS Area 000F0000h 000FFFFFh System BIOS Area (Storage and RAM Shadowing) Top 0, 1, 4, or 8MB of DRAM Integrated Graphics Memory FFE00000h FFFFFFFFh System Flash CoreModule 730 Reference Manual...
  • Page 22: I/O Address Map

    System reserved 00F0-00FF Math Coprocessor 01F0-01F7 IDE Hard Disk Controller 0201 Watchdog Timer (WDT) 0205 System reserved 02E8-02EF* Serial Port 4 (COM4) 02F8-02FF* Serial Port 2 (COM2) Board Controller Board Controller 0378-037F* Parallel Port (Standard and EPP) Reference Manual CoreModule 730...
  • Page 23: Usb Interfaces

    * Located on the optional expansion module. USB Interfaces The CoreModule 730 contains three root USB (Universal Serial Bus) hubs and seven functional USB ports. The SCH terminates four USB ports to two headers and routes three USB ports to the SUMIT Connector A.
  • Page 24: Ethernet Interface

    Ethernet header which consists of 10 right-angle pins, two rows, odd/even (1,2) pin sequence, and 0.079" (2mm) pitch. Table 3-6. Ethernet Interface Pin/Signal Descriptions (J3) Pin # Signal Description Ground MDI0+ Media Dependent Interface 0 +/- MDI0- Reference Manual CoreModule 730...
  • Page 25: Video Interfaces

    Note: The shaded areas denote power or ground. NOTE The magnetics (isolation transformer, T1) for the Ethernet connector is included on the CoreModule 730. Video Interfaces The SCH chip provides the graphics control and video signals to traditional glass CRT (VGA) monitors and LVDS flat panel displays, supporting full hardware acceleration of H.264 video decode.
  • Page 26: Lvds Interface

    Data 1 Negative Output LVDS_DAT0+ Data 0 Positive Output LVDS_DAT0- Data 0 Negative Output LVDS_BKLT_CTRL Backlight Control LVDS_VDD_EN LCD Enable LVDS_DDC_CLK Clock LVDS_DDC_DATA Data LVDS_BKLT_EN Backlight Enable Not connected Note: The shaded areas denote power or ground. Reference Manual CoreModule 730...
  • Page 27: Utility Interface

    Real Time Clock (RTC) The CoreModule 730 contains a Real Time Clock (RTC). The CMOS RAM can be backed up with a lithium battery. If the battery is not present, a battery-free boot option in the BIOS completes the boot process and resets the clock to the default date and time.
  • Page 28: User Gpio Interface

    User GPIO Interface The CoreModule 730 provides GPIO pins for customer use, and the signals are routed to header J20 which uses 10 pins with odd/even (1,2) pin sequence and 0.049" (2mm) pitch. An example of how to use the GPIO pins resides in the Miscellaneous Source Code Examples on the CoreModule 730 Support QuickDrive Table 3-10.
  • Page 29: Ethernet External Led

    CoreModule 730 Support Software QuickDrive. Power Interface The CoreModule 730 requires one +5 volt DC power source and uses a 10-pin header with odd/even (1, 2) pin sequence and 0.10" (2.54mm) pitch. If the +5VDC power drops below ~4.65V, a low voltage reset is triggered, resetting the system.
  • Page 30 Chapter 3 Hardware Table 3-14. Power Interface Pin/Signals (J23) +12V +12 volts routed to PC/104 Ground Not connected Ground +5 Volts Ground +5 Volts Note: The shaded areas denote power or ground. Reference Manual CoreModule 730...
  • Page 31: Chapter 4 Bios Setup

    OEM Logo Utility (Splash Screen) The CoreModule 730 BIOS supports a graphical logo utility, which can be customized by the user and displayed when enabled through the BIOS Setup Utility. The graphical image can be a company logo or any custom image the user wants to display during the boot process.
  • Page 32 Chapter 4 BIOS Setup Reference Manual CoreModule 730...
  • Page 33: Appendix A Technical Support

    Appendix A Technical Support ADLINK Technology, Inc. provides a number of methods for contacting Technical Support listed in the Table A-1 below. Requests for support through the Ask an Expert are given the highest priority, and usually will be addressed within one working day.
  • Page 34 Appendix A Technical Support Reference Manual CoreModule 730...
  • Page 35: Index

    Jumpers connectors settings ............11 pin arrangement description ......10 pin identification ........... 10 Lithium Battery CoreModule 730 real time clock (RTC) ........23 2 GB SDRAM memory ........ 16 logo screen block diagram ..........6 requirements ..........27 connector locations ......... 9 low voltage limit ..........25...
  • Page 36 (2) ........21 integrated circuit (IC) specifications ....1 watchdog timer (WDT) ......5 weight ..............12 Technical Support Ask an Expert ..........29 contact information ........29 InfoCenter ............. 29 thermal cooling heatsinks ............13 Reference Manual CoreModule 730...

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