Outline Dimensions; Ordering Guide - Analog Devices ADF7021-V Manual

ADF7021-V

OUTLINE DIMENSIONS

1.00
12° MAX
0.85
0.80
SEATING
PLANE

ORDERING GUIDE

1
Model
ADF7021-VBCPZ
ADF7021-VBCPZ-RL
EVAL-ADF70XXMBZ2
EVAL-ADF7021-VDB1Z
EVAL-ADF7021-VDB2Z
1 Z = RoHS Compliant Part.
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7.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
BSC SQ
0.80 MAX
0.65 TYP
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 78. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
D08635-0-4/10(0)
0.60 MAX
0.60 MAX
37
36
EXPOSED
6.75
PAD
(BOTTOM VIEW)
0.50
0.40 25
24
0.30
5.50
REF
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
(CP-48-3)
Package Description
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Platform Mother Board
450 MHz to 470 MHz Daughter Board
868 MHz to 870 MHz Daughter Board
Rev. 0 | Page 60 of 60
0.30
0.23
0.18
PIN 1
INDICATOR
48
1
4.25
4.10 SQ
3.95
12
13
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Package Option
CP-48-3
CP-48-3