Outline Dimensions; Ordering Guide - Analog Devices AD9866 Instructions Manual

OUTLINE DIMENSIONS

1.00
12° MAX
0.85
0.80

ORDERING GUIDE

Model Temperature Range
AD9866BCP −40°C to +85°C
AD9866BCPRL −40°C to +85°C
AD9866BCPZ 1 −40°C to +85°C
1
AD9866BCPZRL −40°C to +85°C
AD9866CHIPS
AD9866-EB
1
Z = Pb-free part.
9.00
BSC SQ
PIN 1
INDICATOR
TOP
BSC SQ
VIEW
0.80 MAX
0.65 TYP
0.50 BSC
SEATING
PLANE
* COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 85. 64-Lead Lead Frame Chip Scale Package (LFCSP)
Dimensions shown in millimeters
0.60 MAX
0.60 MAX
49
48
8.75
EXPOSED PAD
(BOTTOM VIEW)
0.45
0.40
33
32
0.35
7.50
REF
0.05 MAX
0.02 NOM
0.20 REF
[CP-64-3]
Package Description
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
64-Lead LFCSP
DIE
Evaluation Board
Rev. A | Page 47 of 48
0.30
0.25
0.18
PIN 1
INDICATOR
64
1
* 7.25
7.10 SQ
6.95
16
17
0.25 MIN
Package Option
CP-64-3
CP-64-3
CP-64-3
CP-64-3
AD9866