Thermal Dissipation - Quectel LTE-A Module Series Hardware Design

The following table shows the modules' electrostatic discharge characteristics.
Table 41: Electrostatic Discharge Characteristics (Temperature: 25 º C, Humidity: 40%)
Interfaces Contact Discharge
VCC, GND TBD
Antenna Interfaces TBD
Other Interfaces TBD

6.9. Thermal Dissipation

EM120R-GL&EM160R-GL are designed to work over an extended temperature range. In order to achieve
a better performance while working under extended temperatures or extreme conditions (such as with
maximum power or data rate, etc.) for a long time, it is strongly recommended to add a thermal pad or
other thermally conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area (i.e. the area for adding thermal pad) is shown as below. The dimensions are
measured in mm.
Figure 38: Thermal Dissipation Area on Bottom Side of Module (Top View)
EM120R-GL&EM160R-GL_Hardware_Design
LTE-A Module Series
EM120R-GL&EM160R-GL Hardware Design
Air Discharge Unit
TBD kV
TBD kV
TBD kV
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