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6.6. Operating and Storage Temperatures
Table 53: Operating and Storage Temperatures
Parameter
Operating Temperature Range
Extended Temperature Range
Storage temperature range
6.7. Thermal Dissipation
The module offers the best performance when all internal IC chips are working within their operating
temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may
still work but the performance and function (such as RF output power, data rate.) will be affected to a
certain extent. Therefore, the thermal design should be maximally optimized to ensure all internal IC chips
always work within the recommended operating temperature range.
The following principles for thermal consideration are provided for reference:
⚫
Keep the module away from heat sources on your PCB, especially high-power components such as
processor, power amplifier, and power supply.
⚫
Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible.
⚫
Follow the principles below when the heatsink is necessary:
-
Do not place large size components in the area where the module is mounted on your PCB to
reserve enough place for heatsink installation;
-
Attach the heatsink to the shielding cover of the module; In general, the base plate area of the
heatsink should be larger than the module area to cover the module completely;
-
Choose the heatsink with adequate fins to dissipate heat;
-
Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and
good wettability and place it between the heatsink and the module;
-
Fasten the heatsink with four screws to ensure that it is in close contact with the module to
prevent the heatsink from falling off during the drop, vibration test, or transportation.
9
To meet this operating temperature range, you need to ensure effective thermal dissipation, for example, by adding
passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module can meet 3GPP specifications.
10
To meet this extended temperature range, you need to ensure effective thermal dissipation, for example, by adding
passive or active heatsinks, heat pipes, vapor chambers, etc. Within this range, the module remains the ability to establish
and maintain functions such as voice, SMS, without any unrecoverable malfunction. Radio spectrum and radio network are
not influenced, while one or more specifications, such as P
tolerances of 3GPP. When the temperature returns to the normal operating temperature level, the module will meet 3GPP
specifications again.
RG520N-AT_Hardware_Design
Min.
9
-30
10
-40
-40
, may undergo a reduction in value, exceeding the specified
out
5G Module Series
Typ.
Max.
+25
+75
-
+85
-
+90
Unit
° C
° C
° C
87 / 109
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