I/O Requirements; Operation And Storage Temperatures - Quectel LTE-A Module Series Hardware Design

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6.3. I/O Requirements

Table 36: I/O Requirements
Parameter
Description
V
Input high voltage
IH
V
Input low voltage
IL
V
Output high voltage
OH
V
Output low voltage
OL
NOTE
1)
V
refers to I/O power domain.
DD18

6.4. Operation and Storage Temperatures

Table 37: Operation and Storage Temperatures
Parameter
Operating temperature Range
1)
Extended Temperature Range
2)
Storage temperature Range
NOTES
1)
1.
Within operating temperature range, the module is 3GPP compliant. For those end devices with bad
thermal dissipation condition, a thermal pad or other thermal conductive components may be required
between the module and main PCB to achieve the full operating temperature range.
2.
2)
Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
EM120R-GL&EM160R-GL_Hardware_Design
EM120R-GL&EM160R-GL Hardware Design
Min.
Max.
0.7 × V
DD18 1)
V
-0.3
0.3 × V
V
- 0.5
V
DD18
0
0.4
Min.
Typ.
-25
+25
-40
-40
LTE-A Module Series
Unit
+ 0.3
V
DD18
V
DD18
V
DD18
V
Max.
Unit
+75
º C
+85
º C
+90
º C
65 / 79

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