Electrostatic Discharge; Thermal Dissipation - Quectel Smart Module Series Hardware Design

6.5. Electrostatic Discharge

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it should be
subject to ESD handling precautions that are typically applied to ESD sensitive components. Proper ESD
handling and packaging procedures must be applied throughout the processing, handling and operation
of any application that incorporates the module.
The following table shows the electrostatic discharge characteristics of SA800U-WF module.
Table 41: ESD Characteristics (Temperature: 25 ° C, Humidity: 45 %)
Test Points
VBAT, GND
FM Antenna Interface
BT Antenna Interface
Other Antenna Interfaces
Other Interfaces

6.6. Thermal Dissipation

To achieve a maximum performance while working under extended temperatures or extreme conditions
(such as with maximum power) for a long time, it is strongly recommended to apply thermal conductive
gap fillers to the gaps between the shielding cover and heat-generating components in the module for
better thermal dissipation.
There are other measures to enhance thermal dissipation:

Place the module away from other heat sources.

Select a suitable mechanical enclosure for the terminal product integrating the SA800U-WF module,
and apply special treatment to the surface of the enclosure to enhance its heat radiation capability.

Forced convection cooling scheme is highly recommended for the module to decrease the
temperature rise, such as attaching an active heat sink with adequate cooling capacity to the top of
the shielding cover.
SA800U-WF_Hardware_Design
Contact Discharge
+/-8
+/-4
+/-3
+/-4
+/-0.5
SA800U-WF Hardware Design
Air Discharge
+/-12
+/-8
+/-6
+/-8
+/-1
Smart Module Series
Unit
kV
kV
kV
kV
kV
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