Esd Characteristics; Thermal Dissipation - Quectel RM500Q-AE Manual

6.8. ESD Characteristics

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module electrostatic discharge characteristics.
Table 383837: Electrostatic Discharge Characteristics (Temperature: 25 º C, Humidity: 40 %)
Tested Interfaces
VCC, GND
Antenna Interfaces
Other Interfaces

6.9. Thermal Dissipation

RM500Q-AE&RM502Q-AE is designed to work over an extended temperature range. In order to achieve
a maximum performance while working under extended temperatures or extreme conditions (such as with
maximum power or data rate) for a long time, it is strongly recommended to add a thermal pad or other
thermally conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area on the bottom (i.e. the area for adding thermal pad) is shown as below on
the below, and conductive compounds are also added on the BB, MCP, PMU, WTR, PA-1, PA-2 chips
inside the module. The dimensions are measured in mm.
RM500Q-AE&RM502Q-AE_Hardware_Design
Contact Discharge
± 5
± 4
± 0.5
RM500Q-AE&RM502Q-AE Hardware Design
Air Discharge
± 10
± 8
± 1
5G Module Series
Unit
kV
kV
kV
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