Thermal Dissipation - Quectel RG255C-GL Hardware Design

Table 27: GNSS Power Consumption
Description
Searching
(AT+CFUN=0)
Tracking
(AT+CFUN=0)

6.5. Thermal Dissipation

Figure 19: Distribution of Heat Source Chips Inside the Module
The module offers the best performance when all internal IC chips are working within their operating
temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may
RG255C-GL_Mini_PCIe_Hardware_Design
Condition
Cold start @ Passive antenna
Lost state @ Passive antenna
Instrument environment
5G Module Series
Typ. Unit
TBD mA
TBD mA
TBD mA
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