Quectel LTE-A Module Series Hardware Design page 71

There are some other measures to enhance heat dissipation performance:
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Add ground vias as many as possible on PCB.
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Maximize airflow over/around the module.
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Place the module away from other heating sources.
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Module mounting holes must be used to attach (ground) the device to the main PCB ground.
It is NOT recommended to apply solder mask on the main PCB where the module's thermal
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dissipation area is located.
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Select an appropriate material, thickness and surface for the outer housing (i.e. the mechanical
enclosure) of the application device that integrates the module so that it provides good thermal
dissipation.
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Customers may also need active cooling to pull heat away from the module.
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If possible, add a heatsink on the top of the module. A thermal pad should be used between the
heatsink and the module, and the heatsink should be designed with as many fins as possible to
increase heat dissipation area.
NOTE
For more detailed guidelines on thermal design, refer to document [5].
EM120R-GL&EM160R-GL_Hardware_Design
LTE-A Module Series
EM120R-GL&EM160R-GL Hardware Design
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