Functional Diagram - Quectel LTE-A Module Series Hardware Design

Extended temperature range: -40 ° C to +85 ° C
Storage temperature range: -40 ° C to +90 ° C
Firmware Upgrade USB 2.0 interface, PCIe interface and DFOTA
RoHS All hardware components are fully compliant with EU RoHS directive
NOTES
1. 1) Within operating temperature range, the module is 3GPP compliant. For those end devices with
bad thermal dissipation condition, a thermal pad or other thermal conductive components may be
required between the module and main PCB to achieve the full operating temperature range.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters
like P might reduce in their values and exceed the specified tolerances. When the temperature
out
returns to normal operating temperature level, the module will meet 3GPP specifications again.
"*" means under development.
3.

2.3. Functional Diagram

The following figure shows a block diagram of EM120R-GL&EM160R-GL.
VCC
FULL_CARD_POWER_OFF#
RESET#
USB2.0&USB3.0
(U)SIM1&(U)SIM2
W_DISABLE1#
WWAN_LED#
WAKE_ON_WAN#
RFFE
PCM
GPIOs
W_DISABLE2#
PCIe
EM120R-GL&EM160R-GL_Hardware_Design
EM120R-GL&EM160R-GL Hardware Design
PMIC
38.4M
XO
Tx
PRx
IQ
MIMO1
Baseband
MIMO2
Control
DRx
NAND Flash +
DDR4 SDRAM
Figure 1: Functional Diagram
LTE-A Module Series
2)
ANT_DIV/GNSS
MIMO1
MIMO2
ANT_MAIN
14 / 79