Esd Characteristics; Thermal Dissipation - Quectel EM12-G Hardware Design

LTE-TDD B66 (10M)
NOTES
1)
1. SIMO is a smart antenna technology that uses a single antenna at the transmitter side and multiple
(two for EM12-G) antennas at the receiver side, which can improve Rx performance.
2)
2. Per 3GPP specification.

6.8. ESD Characteristics

The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module electrostatic discharge characteristics.
Table 29: Electrostatic Discharge Characteristics (Temperature: 25º C, Humidity: 40%)
Tested Points
VBAT, GND
Antenna Interfaces
Other Interfaces

6.9. Thermal Dissipation

EM12-G is designed to work over an extended temperature range. In order to achieve a maximum
performance while working under extended temperatures or extreme conditions (such as with maximum
power or data rate, etc.) for a long time, it is strongly recommended to add a thermal pad or other
thermally conductive compounds between the module and the main PCB for thermal dissipation.
The thermal dissipation area (i.e. the area for adding thermal pad) is show as below. The dimensions are
measured in mm.
EM12-G_Hardware_Design
-97.0 -96.0
Contact Discharge
± 5
± 4
± 0.5
LTE-A Module Series
EM12-G Hardware Design
-99.0dBm -95.8dBm
Air Discharge
± 10
± 8
± 1
Unit
kV
kV
kV
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