Quectel LCC Series User Manual
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Quectel LCC Series User Manual

Quectel LCC Series User Manual

Module secondary smt
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Module Secondary SMT
User Guide
LCC/LGA Module Series
Rev. Module_Secondary_SMT_User_Guide_V2.5
Date: 2019-03-11
Status: Released
www.quectel.com

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Summary of Contents for Quectel LCC Series

  • Page 1 Module Secondary SMT User Guide LCC/LGA Module Series Rev. Module_Secondary_SMT_User_Guide_V2.5 Date: 2019-03-11 Status: Released www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    EC21/EC25/EG91/EG95/BG96/FC10/FC20/SC10/ SC20/SG30/AG35 modules in Chapter 4.2. 2. Added desoldering and repair instructions in Chapter 5 and 6. 1. Updated the MSL rating of Quectel modules into 3. Rowan WANG/ 2. Updated stencil design requirements in Chapter 4.2. 2018-06-02 Alain HUANG 3.

  • Page 4: Table Of Contents

    LCC/LGA Module Series Module Secondary SMT User Guide Content About the Document ........................... 2 Content ................................. 3 Table Index ..............................4 Figure Index ..............................5 Introduction ............................6 Information about Modules ......................... 7 2.1. Surface-Mount Packaging Type ....................7 2.2. Packing Methods ..........................
  • Page 5 LCC/LGA Module Series Module Secondary SMT User Guide Table Index TABLE 1: STENCIL DESIGN REQUIREMENTS ....................10 TABLE 2: RECOMMENDED THERMAL PROFILE PARAMETERS ..............20 TABLE 3: HEAT GUN DESOLDERING REQUIREMENTS ................22 TABLE 4: TERMS AND ABBREVIATIONS ......................25 Module_Secondary_SMT_User_Guide 4 / 25...
  • Page 6 LCC/LGA Module Series Module Secondary SMT User Guide Figure Index FIGURE 1: TAPE & REEL PACKING ........................7 FIGURE 2: HUMIDITY INDICATOR CARD ......................9 FIGURE 3: STEP-UP STENCIL AREA ......................18 FIGURE 4: AUTOMATIC PLACEMENT ......................19 FIGURE 5: FIRST PIN AND MOUNTED PICTURE ..................19 FIGURE 6: RAMP-SOAK-SPIKE REFLOW PROFILE ..................

  • Page 7: Introduction

    LCC/LGA Module Series Module Secondary SMT User Guide Introduction This document describes the process of Quectel modules’ secondary SMT and desoldering. It is applicable to all Quectel modules in LCC or LGA form factor. Module_Secondary_SMT_User_Guide 6 / 25...

  • Page 8: Information About Modules

    Module Secondary SMT User Guide Information about Modules 2.1. Surface-Mount Packaging Type Quectel modules adopt LCC or LGA package. 2.2. Packing Methods Quectel provides tape and reel pack as shown in the following figure. Figure 1: Tape & Reel Packing Module_Secondary_SMT_User_Guide 7 / 25...

  • Page 9: Requirements On Chip Mounter

    25mm×20mm, the nozzle diameter should be 8mm at least. 3.2. Soldering Requirements 1. It is recommended to use reflow soldering equipment with eight zones at least. For Quectel LTE, LPWA, Automotive and Smart series modules, reflow soldering equipment with at least ten zones is recommended.

  • Page 10: Attentions For Manufacturing

    Quectel SMD module is sensitive to moisture absorption. According to IPC-JEDEC standard, the moisture sensitive level (MSL) of Quectel SMD modules is defined as “3”. Please make sure the package is intact before using. After opening the package, please confirm the status of humidity indicator card in the vacuum-sealed package.

  • Page 11: Stencil Design Requirements

    1mm should be left between outward end of the aperture and the component. The stencil design requirements for Quectel modules are shown in the table below. Diagrams in the table are only typical examples of corresponding modules. Diagrams of different modules listed in the same row may vary but the stencil requirements for them are identical.
  • Page 12 LCC/LGA Module Series Module Secondary SMT User Guide 1. The stencil thickness of the area for the L10/L16/L20/L26/ module should be partly stepped-up to L30/L50/L70/L76/ 0.13-0.15mm. L80/L70-R/ 2. The innermost edge of the aperture for each L70-RL/L76-L/ single pad should be shifted outward by L76B/L80-R/L86/ 0.10mm (refer to h1) and the outermost edge...
  • Page 13 LCC/LGA Module Series Module Secondary SMT User Guide The stencil thickness of the area for the module should be partly stepped-up to 0.18-0.20mm. For pads on four sides: The innermost edge of the aperture for each single pad should be shifted outward by 0.20mm and outermost edge should be shifted outward by 0.40-0.60mm, and the width should be reduced in a ratio of 1:0.85.
  • Page 14 LCC/LGA Module Series Module Secondary SMT User Guide four 1.00mm×0.65mm smaller apertures shaped in 0.05mm square with round chamfers, and with clearance of 0.25mm in between. 4. The 12 pins in the very center are used for R&D test and recommended to be kept intact.
  • Page 15 LCC/LGA Module Series Module Secondary SMT User Guide The yellow block in the very center should be kept intact. 1. The stencil thickness of the area for the module should be partly stepped-up to 0.13-0.15mm. 2. For pads on four sides: The aperture for each single pad should be UG95/UG96/ centered with area reduced to 75%-85%.
  • Page 16 LCC/LGA Module Series Module Secondary SMT User Guide The stencil aperture should be designed into diagonal-patterned lines with 60% area of the corresponding pad. 1. The stencil thickness of the area for the module should be partly stepped-up to 0.18-0.20mm. 2.
  • Page 17 LCC/LGA Module Series Module Secondary SMT User Guide 1. The stencil thickness of the area for the module should be partly stepped-up to 0.18-0.20mm. 2. For pads on four sides: The innermost edge of aperture for each single pad should be shifted outward by 0.20mm and the outermost edge should be shifted outward by 0.60-0.80mm, while the width should be reduced in a ratio of 1:0.85.
  • Page 18 LCC/LGA Module Series Module Secondary SMT User Guide 1. The stencil thickness of the area for the module should be partly stepped-up to 0.13-0.15mm. 2. The stencil aperture area for the pads on four sides should be centered with area reduced to 75%-85%, and should be designed with round chamfers.

  • Page 19: Mounting Process

    LCC/LGA Module Series Module Secondary SMT User Guide 1. The stencil thickness of the area for the module should be partly stepped-up to 0.13-0.15mm. 2. For pads on four sides: The stencil aperture for each pad should AF20 be centered with area reduced to 75%-85% and the shape should be rectangle with round chamfers.

  • Page 20: Automatic Placement

    LCC/LGA Module Series Module Secondary SMT User Guide For tape and reel packed modules, there is a need to set the feeding spacing according to actual conditions. 4.3.2. Automatic Placement Select a suitable nozzle according to the module size. To keep module’s stability, please ensure that the nozzle is placed in the center of gravity, image detection and recognition are 100% passed, and keep a medium speed when mounting the module.

  • Page 21: Reflow Soldering

    LCC/LGA Module Series Module Secondary SMT User Guide 4.4. Reflow Soldering Please refer to the recommended ramp-soak-spike thermal profile for lead-free reflow soldering in the following figure. Temp. (° C) Reflow Zone Max slope: Cooling down 2~3° C/sec slope: 1~4° C/sec Soak Zone Max slope: 1~3°...
  • Page 22 LCC/LGA Module Series Module Secondary SMT User Guide Reflow Cycle Max reflow cycle NOTES 1. For modules with paper labels: ⚫ During manufacturing and soldering, or any other processes that may contact the module directly, NEVER wipe the module label with organic solvents, such as acetone, ethyl alcohol, isopropyl alcohol, trichloroethylene, etc.

  • Page 23: Desoldering

    LCC/LGA Module Series Module Secondary SMT User Guide Desoldering Please use a heat gun to heat the solder joints so as to remove the module from the motherboard. ⚫ The temperature of the heat gun should be about 350º C in order to release enough heat. The wind speed should be adjusted according to actual situation.
  • Page 24 Figure 8: Module Soldering Quality Inspection NOTE For the rework requirements of Quectel AG35 module, please refer to Quectel_AG35_Secondary_ SMT_Guidelines. Module_Secondary_SMT_User_Guide 23 / 25...

  • Page 25: Repair Instructions

    PCBA is 3. If the module is not restored after three times’ repairing, it is recommended to be scrapped. NOTE For the rework requirements of Quectel AG35 module, please refer to Quectel_AG35_Secondary_ SMT_Guidelines. Module_Secondary_SMT_User_Guide 24 / 25...

  • Page 26: Appendix Reference

    LCC/LGA Module Series Module Secondary SMT User Guide Appendix Reference Table 4: Terms and Abbreviations Abbreviation Description Leadless Chip Carriers Land Grid Array Moisture Sensitivity Level Printed Circuit Board Surface Mount Device Surface Mount Technology Module_Secondary_SMT_User_Guide 25 / 25...

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