Copper Heatsink - Intel Celeron D Thermal Design Manual

Intel Enabled Thermal Solutions
maximum T
entire thermal solution, from heatsink design, chassis configuration, and airflow source, must be
optimized for server systems to obtain the best performing solution.
Intel has worked with a third-party vendor to enable a heatsink design for the Celeron D Processor
in the 775-land LGA package for the 1U form factor. This design was optimized for the 1U form
factor within the available volume for the thermal solution. The motherboard component keep-ins
are shown in
page 62 and
page 63.
This solution requires 100 percent of the airflow to be ducted through the heatsink fins to prevent
heatsink bypass. A copper base and copper fin heatsink are attached to the motherboard with the
use of a backplate. This solution is shown in
Figure 9. 1U Copper Heatsink
Based on preliminary testing, this heatsink has shown to have a performance (Ψ
with 18 CFM of airflow. This will allow a maximum T
Thermal Profile specification as described in the processor datasheet. This heatsink solution uses
the Honeywell* PCM45F as the Thermal Interface Material (TIM). The performance of the
heatsink could improve with more airflow, however the final intended thermal solution including,
heatsink, airflow source, TIM, and attach mechanism must be validated by system integrators.
Developers of thermal solutions for the Intel Celeron D Processor in the 775-Land LGA Package
must ensure that the solution meets the processor thermal specifications as stated in the processor
datasheet and follow the recommended motherboard component keep-out as shown in
and Figure
the voltage regulator components. In addition to this, a thermal solution design must meet the
maximum component heights as specified by the 1U Thin Electronics Bay Specifications located at
http://www.ssiforum.org.
outlined in the specification.
Intel
32
, acoustic requirements, etc.) to meet the processor's thermal requirements. The
LA
Figure 37, "1U/2U Motherboard Component Keep-In Definition, Primary Side" on
Figure 38, "1U/2U Motherboard Component Keep-In Definition, Secondary Side" on
38. This keep-out will ensure that the processor thermal solution will not interfere with
Figure 10 illustrates the z-height constraints of the 1U form factor as
® ®
Celeron D Processor in the 775-Land LGA Package Thermal Design Guide
Figure 9.
of 40 °C and meet the processors
LA
) of 0.325 °C/W
CA
Figure 37
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